100% foundry compatible packaging and full wafer release and die separation technique for surface micromachined devices
Description:
A completely foundry compatible chip-scale package for surface micromachines has been successfully demonstrated. A pyrex (Corning 7740) glass cover is placed over the released surface micromachined die and anodically bonded to a planarized polysilicon bonding ring. Electrical feedthroughs for the surface micromachine pass underneath the polysilicon sealing ring. The package has been found to be hermetic with a leak rate of less than 5 x 10{sup {minus}8} atm cm{sup {minus}3}/s. This technology h…
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Date:
April 6, 2000
Creator:
Oliver, Andrew D. & Matzke, Carolyn M.
Item Type:
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