100% foundry compatible packaging and full wafer release and die separation technique for surface micromachined devices

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Description

A completely foundry compatible chip-scale package for surface micromachines has been successfully demonstrated. A pyrex (Corning 7740) glass cover is placed over the released surface micromachined die and anodically bonded to a planarized polysilicon bonding ring. Electrical feedthroughs for the surface micromachine pass underneath the polysilicon sealing ring. The package has been found to be hermetic with a leak rate of less than 5 x 10{sup {minus}8} atm cm{sup {minus}3}/s. This technology has applications in the areas of hermetic encapsulation and wafer level release and die separation.

Physical Description

2 p.

Creation Information

Oliver, Andrew D. & Matzke, Carolyn M. April 6, 2000.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 47 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A completely foundry compatible chip-scale package for surface micromachines has been successfully demonstrated. A pyrex (Corning 7740) glass cover is placed over the released surface micromachined die and anodically bonded to a planarized polysilicon bonding ring. Electrical feedthroughs for the surface micromachine pass underneath the polysilicon sealing ring. The package has been found to be hermetic with a leak rate of less than 5 x 10{sup {minus}8} atm cm{sup {minus}3}/s. This technology has applications in the areas of hermetic encapsulation and wafer level release and die separation.

Physical Description

2 p.

Notes

OSTI as DE00753457

Medium: P; Size: 2 pages

Source

  • Solid State Sensor and Actuator Workshop, Hilton Head, SC (US), 06/04/2000--06/08/2000

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Identifier

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  • Report No.: SAND2000-0852C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 753457
  • Archival Resource Key: ark:/67531/metadc706080

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • April 6, 2000

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 10, 2017, 2:57 p.m.

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Oliver, Andrew D. & Matzke, Carolyn M. 100% foundry compatible packaging and full wafer release and die separation technique for surface micromachined devices, article, April 6, 2000; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc706080/: accessed June 20, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.