Several groups of plastic molded CD4011 were electrically tested as part of an Army dormant storage program. For this test, parts had been in storage in missile containers for 4.5 years. Eight of the parts (out of 1200) failed the electrical tests and were subsequently analyzed to determine the cause of the failures. The root cause was found to be corrosion of the unpassivated Al bondpads. No significant attack of the passivated Al traces was found. Seven of the eight failures occurred in parts stored on a preposition ship (Jeb Stuart), suggesting a link between the external environment and observed …
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Several groups of plastic molded CD4011 were electrically tested as part of an Army dormant storage program. For this test, parts had been in storage in missile containers for 4.5 years. Eight of the parts (out of 1200) failed the electrical tests and were subsequently analyzed to determine the cause of the failures. The root cause was found to be corrosion of the unpassivated Al bondpads. No significant attack of the passivated Al traces was found. Seven of the eight failures occurred in parts stored on a preposition ship (Jeb Stuart), suggesting a link between the external environment and observed corrosion.
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Sorensen, Neil Robert.Failure analysis for the dual input quad NAND fate CD4011 under dormant storage conditions.,
report,
November 1, 2004;
United States.
(https://digital.library.unt.edu/ark:/67531/metadc928840/:
accessed June 5, 2024),
University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.