Microchannel cooling of face down bounded chips Page: 2 of 21
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IL-8632
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MICROCHANNEL COOLING OF FACE DOWN BONDED CHIPS
The United States government has rights in this invention pursuant
to Contract Number W-7405-ENG-48 between the United States
Department of Energy and the University of California for the operation
of Lawrence Livermore National Laboratory.
5
CROSS REFERENCE TO RELATED APPLICATION
The present application is related to U.S. patent application entitled
THREE DIMENSIONAL, MULTI-CHIP MODULE, Serial No. _
filed on tL3 same day as the present application, and owned at the time
10 of invention and currently by the same assignee.
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to cooling high power integrated
15 circuits; and particularly to microchannel cooling of integrated circuits
bonded face down on circuit boards, such as by flip-chip bonding.
Description of the Related Art
Many computer systems rely on so-called flip-chip bonding of die for
20 electrical and mechanical attachment of integrated circuit chips to circuit
boards. See, Goldman, et al., "Area Array Solder Interconnections for
VLSI", SOLID STATE TECHNOLOGY, June, 1983, pp. 91-97. In flip-
chip bonds, the integrated circuits are mounted face down on the circuit
board. Solder bumps are coupled to bonding sites on the integrated
25 circuits and corresponding bonding sites on the circuit board. The
principal advantages of flip-chip bonding are a relative lack of electrical
parasitics associated with the electrical connection, relatively high I/O
available (in principal, at least), and repairability by removal and
replacement of the chips. On the other hand, a significant difficulty is
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mah /1ni-1 /8632.002 2/10/92-14:22
AIlomey Docket No.: LLNL-18662M~i
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Bernhardt, A. F. Microchannel cooling of face down bounded chips, patent, December 1992; California. (https://digital.library.unt.edu/ark:/67531/metadc622922/m1/2/: accessed April 26, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.