Microchannel cooling of face down bounded chips

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Description

The present invention relates to cooling high power integrated circuits; and particularly to microchannel cooling of integrated circuits bonded face down on circuit boards, such as by flip-chip bonding. Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure ... continued below

Physical Description

20 p.

Creation Information

Bernhardt, A. F. December 1992.

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This patent is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 22 times . More information about this patent can be viewed below.

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Description

The present invention relates to cooling high power integrated circuits; and particularly to microchannel cooling of integrated circuits bonded face down on circuit boards, such as by flip-chip bonding. Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Physical Description

20 p.

Notes

OSTI as DE94007332

Source

  • Other Information: PBD: 1992

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  • Other: DE94007332
  • Report No.: PATENTS-US--A7850634
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 140523
  • Archival Resource Key: ark:/67531/metadc622922

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • December 1992

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

Description Last Updated

  • Feb. 17, 2016, 2:26 p.m.

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Bernhardt, A. F. Microchannel cooling of face down bounded chips, patent, December 1992; California. (digital.library.unt.edu/ark:/67531/metadc622922/: accessed December 9, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.