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Bio-Inspired Material Surfaces with Self-cleaning, Micromanipulation and Water Collection

Description: Geckos are famous for the skill of switchable adhesion that they use to stick on various surface while keep their fingers super clean. In the dissertation, a unique mechanism was discovered to explain gecko self-cleaning phenomena. Using atomic force microscopy (AFM), we managed to compare the microparticle-substrate adhesion and the microparticle-seta adhesion with a single seta bonded to the AFM cantilever. A dynamic effect was approved that high pulling-off speed could increase the micropart… more
Date: May 2019
Creator: Wan, Yiyang

The Effect of Processing Conditions on the Surface Morphology of Few-Layered WS2 Thin Films

Description: Recent progress in layered transition metal dichalcogenides (TMDs) has led to various promising electronic and optoelectronic applications. However, the structure of materials plays a critical role in electronic and optoelectronic devices, and determines performance. Electronic and optoelectronic devices typically consist of multiple layers that form electrical homojunctions or heterojunctions. Therefore, in a device it can be expected that a WS2 layer may serve as the substrate for a subseque… more
Date: May 2019
Creator: Cai, Bimin

Functionalization and characterization of porous low-κ dielectrics.

Description: The incorporation of fluorine into SiO2 has been shown to reduce the dielectric constant of the existing materials by reducing the electrical polarizability. However, the incorporation of fluorine has also been shown to decrease film stability. Therefore, new efforts have been made to find different ways to further decrease the relative dielectric constant value of the existing low-k materials. One way to reduce the dielectric constant is by decreasing its density. This reduces the amount of p… more
Date: May 2005
Creator: Orozco-Teran, Rosa Amelia

Process-Structure-Property Relationships in Friction Stir Welded Precipitation Strengthened Aluminum Alloys

Description: Through a series of carefully designed experiments, characterization and some modeling tools, this work is aimed at studying the role of thermal profiles on different microstructural zones and associated properties like strength and corrosion through a variation of weld parameters, thermal boundary conditions and material temper. Two different alloys belonging to the Al-Cu and Al-Cu-Li system in different temper conditions- peak aged (T8) and annealed (O) were used. A 3D-thermal pseudo mechanic… more
Date: May 2019
Creator: Mondal, Barnali

Study of Conductance Quantization by Cross-Wire Junction

Description: The thesis studied quantized conductance in nanocontacts formed between two thin gold wires with one of the wires coated by alkainthiol self assembly monolayers (SAM), by using the cross-wire junction. Using the Lorenz force as the driving force, we can bring the two wires in contact in a controlled manner. We observed conductance with steps of 2e2 / h. The conductance plateaus last several seconds. The stability of the junction is attributed to the fact that the coating of SAM improves the st… more
Date: May 2004
Creator: Zheng, Tao

Substrate Nanotopography and Stiffness Modulation of Cell Behavior

Description: The physical characteristics (i.e., nanostructure and stiffness) of the extracellular matrix where cells reside have been shown to profoundly affect numerous cellular events in vivo and also been employed to modulate cell behavior in vitro, yet how these physical cues regulate cell behavior is still elusive. Therefore, we engineered a variety of nanotopographies with different shapes and dimensions, and investigated how the nanotopographical cue, through focal adhesions-cytoskeleton-nucleus pat… more
Date: May 2019
Creator: Wang, Kai

Supercritical Silylation and Stability of Silyl Groups

Description: Methylsilsesquioxane (MSQ) and organosilicate glass (OSG) are the materials under this study because they exhibit the dielectric constant values necessary for future IC technology requirements. Obtaining a low-k dielectric value is critical for the IC industry in order to cope time delay and cross talking issues. These materials exhibit attractive dielectric value, but there are problems replacing conventional SiO2, because of their chemical, mechanical and electrical instability after plasma p… more
Date: May 2006
Creator: Nerusu, Pawan Kumar

A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield

Description: One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene … more
Date: May 2004
Creator: Mantiziba, Fadziso
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