Array automated assembly: Phase 2. Quarterly report
Description:
An analysis was made of cost trade-offs for shaping modified square wafers from cylindrical crystals. For reasonably expectable silicon and sheet costs, the optimum shape will be nearer a circle than a square. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. Four glass systems have survived preliminary screening tests for use as edge masking dielectrics. These include beta-spodumen, MgO-Al/sub 2/O/sub 3/ borosilicate, baria and titania …
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Date:
February 1, 1978
Creator:
Taylor, W.E.
Partner:
UNT Libraries Government Documents Department