A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield
Description:
One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene …
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Date:
May 2004
Creator:
Mantiziba, Fadziso
Partner:
UNT Libraries