A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield

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One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene microspheres act as physical barriers between the substrate and suspended microstructures during the final liquid evaporation phase. A plasma ashing process is utilized to completely remove the polystyrene ... continued below

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Mantiziba, Fadziso May 2004.

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  • Mantiziba, Fadziso

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Description

One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene microspheres act as physical barriers between the substrate and suspended microstructures during the final liquid evaporation phase. A plasma ashing process is utilized to completely remove the polystyrene microspheres from the microstructure surfaces. Using this process, release yields > 90% were achieved. It is found that the surface roughness of gold surfaces increases while that of the silicon is reduced due to a thin oxide that grows on the silicon surface during the plasma process.

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UNT Student Graduate Works

This collection houses graduate student works other than theses and dissertations. All materials have been previously accepted by a professional organization or approved by a faculty mentor. The collection includes, but is not limited to problems in lieu of thesis, supplemental files associated with theses and dissertations, posters, recitals, presentations, articles, reviews, book chapters, and artwork. Some items in this collection are restricted to use by the UNT community.

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  • May 2004

Added to The UNT Digital Library

  • Feb. 15, 2008, 3:26 p.m.

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  • March 24, 2016, 4:42 p.m.

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Citations, Rights, Re-Use

Mantiziba, Fadziso. A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield, thesis, May 2004; Denton, Texas. (digital.library.unt.edu/ark:/67531/metadc4457/: accessed September 21, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; .