High performance low cost interconnections for flip chip attachment with electrically conductive adhesive. Final report Page: 130 of 205
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SECTION III: AUTOMATED TESTBED
A. System Overview
The Automated Testbed was built for the concurrent development and characterization of the PMC
bumped chip to board assembly process and equipment. The design goals included the flexibility to adapt
the equipment assembly and process monitoring capabilities.
Figure 1 shows the front view of the system. The system is built upon a 4 foot x 5 foot optical
breadboard top. Underneath the table are two 19 inch rackmount cabinets. One of the cabinets has a 166
MHz industrial PC as the host controller and an AISI 3500 vision engine. The other cabinet has thermode
driver heater cards for the upper and lower bonder heating systems as well as the system power supply.
Next to the cabinets is the X-Y table servo amplifier, and various solenoid valves and regulators for the
control of the pneumatic system.
Mounted to the top surface of the optical table is a stiff overhead beam to which a downward viewing,
substrate location camera and a PMC Bonding Head are separately mounted. The Bonding Head consists
of a theta axis for component rotation, a downward Z axis travel/force drive, and the component pick
up/heating tool. On the table, directly underneath the bonding head, is a two-position shuttle driven by a
pneumatic actuator. The shuttle carries and positions the component viewing illuminator/camera, and the
lower board support/ heating tool directly underneath the component pick up tool.
Upward Looking Camera ECA Bonding Downwari Looking
And Board Support Head Camera
Subsystem
Yiain lonitiri Cootral loailor
Board Pressure Board Support
Control Pneumatics B r Positiuong
E-Stop System
panel Gantry Frame Structure
Computer --
Keyboard Support
1/0 - Pneumatic IBase Frame
Panel
Power Supply
K-T Table Amplifier
Vision Engine Tbermode eater
River Cards
Figure 1 Front View of the Automated PMC Chip Bonding Test System6
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High performance low cost interconnections for flip chip attachment with electrically conductive adhesive. Final report, report, May 1, 1998; United States. (https://digital.library.unt.edu/ark:/67531/metadc707533/m1/130/: accessed May 20, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.