Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The …
continued below
Publisher Info:
Sandia National Labs., Albuquerque, NM (United States)
Place of Publication:
Albuquerque, New Mexico
Provided By
UNT Libraries Government Documents Department
Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.
Descriptive information to help identify this article.
Follow the links below to find similar items on the Digital Library.
Description
Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.
This article is part of the following collection of related materials.
Office of Scientific & Technical Information Technical Reports
Reports, articles and other documents harvested from the Office of Scientific and Technical Information.
Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.
Hosking, F M & Keicher, D M.Fluxless laser soldering for electronic packaging,
article,
January 1, 1991;
Albuquerque, New Mexico.
(https://digital.library.unt.edu/ark:/67531/metadc1100103/:
accessed July 16, 2024),
University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.
