Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects …
continued below
Publisher Info:
Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
Place of Publication:
Albuquerque, New Mexico
Provided By
UNT Libraries Government Documents Department
Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.
Descriptive information to help identify this article.
Follow the links below to find similar items on the Digital Library.
Description
Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.
This article is part of the following collection of related materials.
Office of Scientific & Technical Information Technical Reports
Reports, articles and other documents harvested from the Office of Scientific and Technical Information.
Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.
VIANCO, PAUL T.Solder Mounting Technologies for Electronic Packaging,
article,
September 23, 1999;
Albuquerque, New Mexico.
(https://digital.library.unt.edu/ark:/67531/metadc620474/:
accessed June 6, 2024),
University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.