Solder Mounting Technologies for Electronic Packaging

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Description

Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects ... continued below

Physical Description

37 p.

Creation Information

VIANCO, PAUL T. September 23, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 12 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.

Physical Description

37 p.

Notes

OSTI as DE00012685

Medium: P; Size: 37 pages

Source

  • Journal Name: Encyclopedia of Materials: Science and Technology; Other Information: Submitted to Encyclopedia of Materials: Science and Technology

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  • Report No.: SAND99-2483J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 12685
  • Archival Resource Key: ark:/67531/metadc620474

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • September 23, 1999

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

Description Last Updated

  • April 12, 2017, 2:23 p.m.

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Citations, Rights, Re-Use

VIANCO, PAUL T. Solder Mounting Technologies for Electronic Packaging, article, September 23, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc620474/: accessed November 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.