Development of a Fluxless Flip Chip Bonding Process for Optical Military Electronics
Description:
As military electronics tend to become lighter, smaller, thinner, and lower cost, the use of flip chip technology is becoming more common place to meet system requirements, yet survive environments. This paper explores the development of an optical flip chip application and details the selection/qualification of the substrate. The selected assembly consists of a procured 1x12 Vertical Cavity Surface Emitting Laser (VCSEL) die, having 80um diameter eutectic AuSn solder bumps at 250um pitch and f…
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Date:
November 11, 2007
Creator:
Girardi, Michael
Item Type:
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Partner:
UNT Libraries Government Documents Department