Formation of Nanopore-Arrays by Plasma-based Thin FilmDeposition Page: 7 of 11
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Figure Captions:
Figure 1: Schematic diagram of forming nanopores using plasma-based thin-film
deposition. The aperture size gradually shrinks due to the copper deposited on the surface
and sidewalls.
Figure 2: (A) Premachined silicon membrane with an array of 5- m-diameter
apertures. (B) After nickel deposition for 30 min, the diameter of each hole was
uniformly reduced to approximately 2 m. (C) Front of the aperture. (D) Back of the
aperture.
Figure 3: A series of apertures before and after copper deposition. Aperture I: (A)
before and (B) after the deposition. Aperture II: (C) before and (D) after the deposition.
Aperture III: (E) before and (F) after the deposition.
Figure 4: SEM micrographs of an aperture after each subsequent copper depositions.
The size of the aperture continues to reduce from (A) 250 nm, to (B) 190 nm, then to (C)
75 nm, and finally (D) reaches 55 nm.
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Ji, Qing; Chen, Y.; Jiang, Ximan; Ji, Lili & Leung, K. N. Formation of Nanopore-Arrays by Plasma-based Thin FilmDeposition, report, March 18, 2005; Berkeley, California. (https://digital.library.unt.edu/ark:/67531/metadc902676/m1/7/: accessed July 16, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.