Fluxless laser soldering for electronic packaging Metadata

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Title

  • Main Title Fluxless laser soldering for electronic packaging

Creator

  • Author: Hosking, F M
    Creator Type: Personal
  • Author: Keicher, D M
    Creator Type: Personal

Contributor

  • Sponsor: United States. Department of Energy.
    Contributor Type: Organization
    Contributor Info: DOE; USDOE, Washington, DC (United States)

Publisher

  • Name: Sandia National Laboratories
    Place of Publication: Albuquerque, New Mexico
    Additional Info: Sandia National Labs., Albuquerque, NM (United States)

Date

  • Creation: 1991-01-01

Language

  • English

Description

  • Content Description: Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.
  • Physical Description: 11 pages

Subject

  • Keyword: Tin Base Alloys
  • Keyword: Elements
  • Keyword: Alloys
  • Keyword: Manganese Additions
  • Keyword: Nickel
  • Keyword: Kovar
  • Keyword: Transition Elements
  • Keyword: Welding 360101* -- Metals & Alloys-- Preparation & Fabrication
  • Keyword: Electromagnetic Radiation
  • Keyword: Radiations
  • Keyword: Cobalt Alloys
  • Keyword: Fabrication
  • Keyword: Soldered Joints
  • Keyword: Joining
  • Keyword: Heating
  • Keyword: Indium Alloys
  • Keyword: Nickel Alloys
  • STI Subject Categories: 42 Engineering
  • Keyword: Soldering
  • Keyword: Iron Alloys
  • Keyword: Manganese Alloys
  • Keyword: Gold
  • Keyword: Joints
  • Keyword: Laser Radiation
  • Keyword: Lead Alloys
  • Keyword: Metals
  • STI Subject Categories: 426000 -- Engineering-- Components, Electron Devices & Circuits-- (1990-)
  • Keyword: Tin Alloys
  • Keyword: Silver Alloys
  • Keyword: Radiation Heating
  • Keyword: Metallurgical Flux
  • STI Subject Categories: 36 Materials Science
  • Keyword: Iron Base Alloys
  • Keyword: Indium Base Alloys

Source

  • Conference: National electronics products conference (NEPCON) west, Anaheim, CA (United States), 23-27 Feb 1992

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Other: DE92003958
  • Report No.: SAND-91-2606C
  • Report No.: CONF-920247--1
  • Grant Number: AC04-76DP00789
  • Office of Scientific & Technical Information Report Number: 5951956
  • Archival Resource Key: ark:/67531/metadc1100103

Note

  • Display Note: OSTI; NTIS; GPO Dep.
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