Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder
Description:
The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, me…
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Date:
May 1993
Creator:
Sees, Jennifer A. (Jennifer Anne)