Copper Wire-Bonding Reliability: Mechanism and Prevention of Galvanic Aluminum Bond Pad Corrosion in Acidic Chloride Environments
Description:
With the reliability requirements of automobile microelectronics pushing towards near 0 ppb levels of failure control, halide induced corrosion issues in wire bonded devices have to be tightly controlled to achieve such a high reliability goal. With real-time corrosion monitoring, for the first time we demonstrated that the explosive H2 evolution coupled with the oxygen reduction reaction, occurring at the critical Al/Cu interfaces, is the key driving force for the observed aggressive corrosion…
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Date:
May 2020
Creator:
Asokan, Muthappan