Faster, more powerful and dense computing hardware generates significant heat and imposes considerable data center cooling requirements. Traditional computer room air conditioning (CRAC) cooling methods are proving increasingly cost-ineffective and inefficient. Studies show that using the volume of room air as a heat exchange medium is wasteful and allows for substantial mixing of hot and cold air. Further, it limits cabinet/frame/rack density because it cannot effectively cool high heat density equipment that is spaced closely together. A more cost-effective, efficient solution for maximizing heat transfer and enabling higher heat density equipment frames can be accomplished by utilizing properly positioned âÃÂÃÂphase changeâÃÂàor âÃÂÃÂtwo-phaseâÃÂàpumped refrigerant cooling methods. Pumping low pressure, oil-free phase changing refrigerant through microchannel heat exchangers can provide up to 90% less energy consumption for the primary cooling loop within the room. The primary benefits of such a solution include reduced energy requirements, optimized utilization of data center space, and lower OPEX and CAPEX. Alcatel-Lucent recently developed a modular cooling technology based on a pumped two-phase refrigerant that removes heat directly at the shelf level of equipment racks. The key elements that comprise the modular cooling technology consist of the following. A pump delivers liquid refrigerant to finned microchannel heat exchangers mounted on the back of equipment racks. Fans drive air through the equipment shelf, where the air gains heat dissipated by the electronic components therein. Prior to exiting the rack, the heated air passes through the heat exchangers, where it is cooled back down to the temperature level of the air entering the frame by vaporization of the refrigerant, which is subsequently returned to a condenser where it is liquefied and recirculated by the pump. All the cooling air enters and leaves the shelves/racks at nominally the same temperature. Results of a 100 kW prototype data center installation of the refrigerant-based modular cooling technology were dramatic in terms of energy efficiency and the ability to cool high-heat-density equipment. The prototype data center installation consisted of 10 racks each loaded with 10 kW of high-heat-density IT equipment with the racks arranged in a standard hot-aisle/cold-aisle configuration with standard cabinet spacing. A typical chilled-water CRAC unit would require approximately 16 kW to cool such a heat load. In contrast, the refrigerant-based modular cooling technology required only 2.3 kW of power for the refrigerant pump and shelf-level fans, a reduction of 85 percent. Differences in hot-aisle and cold-aisle temperature were also substantially reduced, mitigating many issues that arise in purely air-based cooling systems, such as mixing of hot and cold air streams, or from placing high-heat-density equipment in close proximity. The technology is also such that it is able to retro-fit live equipment without service interruption, which is particularly important to the large installed ICT customer base, thereby providing a means of mitigating reliability and performance concerns during the installation, training and validation phases of product integration. Moreover, the refrigerant used in our approach, R134a, is a widely-used, non-toxic dielectric liquid which, unlike water, is non-conducting and non-corrosive and will not damage electronics in the case of a leakâÃÂÃÂa triple-play win over alternative water-based liquid coolant technologies. Finally, through use of a pumped refrigerant, pressures are modest (~60 psi), and toxic lubricants and oils are not required, in contrast to compressorized refrigerant systemsâÃÂÃÂanother environmental win. Project Activities - The ARCTIC project goal was to further develop and dramatically accelerate the commercialization of this game-changing, refrigerant-based, liquid-cooling technology and achieve a revolutionary increase in energy efficiency and carbon footprint reduction for our nationâÃÂÃÂs Information and Communications Technology (ICT) infrastructure. The specific objectives of the ARCTIC project focused in the following three areas: i) advanced research innovations that dramatically enhance the ability to deal with ever-increasing device heat densities and footprint reduction by bringing the liquid cooling much closer to the actual heat sources; ii) manufacturing optimization of key components; and iii) ensuring rapid market acceptance by reducing cost, thoroughly understanding system-level performance, and developing viable commercialization strategies. The project involved participants with expertise in all aspects of commercialization, including research & development, manufacturing, sales & marketing and end users. The team was lead by Alcatel-Lucent, and included subcontractors Modine and USHose.
