Characterization of the titanium/gold (Ti/Au) deposition process used at the Allied-Signal Inc., Albuquerque Microelectronics Operation (AMO) was performed. Tests were conducted to set up evaporation parameters, correlate titanium and gold thicknesses to sheet resistance, improve thickness uniformity, and reduce frontside contamination of deposit material on product wafers. The Ti/Au process is the final step in the production of integrated circuits (ICs) at the AMO wafer fabrication facility. 3 figs.
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Characterization of the titanium/gold (Ti/Au) deposition process used at the Allied-Signal Inc., Albuquerque Microelectronics Operation (AMO) was performed. Tests were conducted to set up evaporation parameters, correlate titanium and gold thicknesses to sheet resistance, improve thickness uniformity, and reduce frontside contamination of deposit material on product wafers. The Ti/Au process is the final step in the production of integrated circuits (ICs) at the AMO wafer fabrication facility. 3 figs.
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