Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
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Fermi National Accelerator Laboratory (FNAL), Batavia, IL
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Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
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Yarema, Raymond; Deptuch, Grezgorz; Hoff, Jim; Shenai, Alpana; Trimpl, Marcel; Zimmerman, Tom et al.3D design activities at Fermilab: Opportunities for physics,
article,
January 1, 2009;
Batavia, Illinois.
(https://digital.library.unt.edu/ark:/67531/metadc1012458/:
accessed June 13, 2024),
University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.