1 mil gold bond wire study.
Description:
In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and …
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Date:
May 1, 2013
Creator:
Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W. & Rutherford, Brian Milne
Partner:
UNT Libraries Government Documents Department