Multi-wire slurry wafering demonstrations
Description:
A series of ten slicing demonstrations on a multi-wire slurry saw, manufactured by Yasunaga Engineering Company of Japan and distributed by GEOS Corporation of Stamford, Connecticut, was made to evaluate the silicon ingot wafering capabilities. The results revealed that the present sawing capabilities can provide usable wafer area from an ingot 1.05 m/sup 2//kg (e.g., kerf width 0.135 mm and wafer thickness 0.265 mm). Satisfactory surface qualities and excellent yield of silicon wafers were fou…
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Date:
February 22, 1978
Creator:
Chen, C. P.
Partner:
UNT Libraries Government Documents Department