Slicing of silicon into sheet material. Final report, January 9, 1976-September 30, 1979
Description:
Complete results, from raw data to interpretation to recommendations, of a program to investigate the use of multiblade slurry sawing to produce silicon wafers from ingots are presented. During the course of this program, the commercially available state of the art process was improved by 20% in terms of area of silicon wafers produced from an ingot. The process was improved 34% on an experimental basis. Production of 20 wafers per centimeter length of 100 mm diameter ingot is now possible on a…
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Date:
September 21, 1979
Creator:
Fleming, J R; Holden, S C & Wolfson, R G
Item Type:
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Partner:
UNT Libraries Government Documents Department