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in subjects: "Miniaturization"

open access

Photonic Band Gap Structures as a Gateway to Nano-Photonics

This LDRD project explored the fundamental physics of a new class of photonic materials, photonic bandgap structures (PBG), and examine its unique properties for the design and implementation of photonic devices on a nano-meter length scale for the control and confinement of light. The low loss, highly reflective and quantum interference nature of a PBG material makes it one of the most promising candidates for realizing an extremely high-Q resonant cavity, >10,000, for optoelectronic applic… more

Date: August 1, 1999

Creator: Fritz, Ian J.; Gourley, Paul L.; Hammons, G.; Hietala, Vincent M.; Jones, Eric D.; Klem, John F. et al.

Item Type: Report

Partner: UNT Libraries Government Documents Department

open access

Advanced micromechanisms in a multi-level polysilicon technology

Quad-level polysilicon surface micromachining technology, comprising three mechanical levels plus an electrical interconnect layer, is giving rise to a new generation of micro-electromechanical devices and assemblies. Enhanced components can not be produced through greater flexibility in fabrication and design. New levels of design complexity that include multi-level gears, single-attempt locks, and optical elements have recently been realized. Extensive utilization of the fourth layer of polys… more

Date: August 1, 1997

Creator: Rodgers, M. S.; Sniegowski, J. J.; Miller, S. L.; Barron, C. C. & McWhorter, P. J.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

IMAP: Interferometry for Material Property Measurement in MEMS

An interferometric technique has been developed for non-destructive, high-confidence, in-situ determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for determining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as suppo… more

Date: March 10, 1999

Creator: Jensen, B. D.; Miller, S. L. & de Boer, M. P.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Micro-miniature radio frequency transmitter for communication and tracking applications

A micro-miniature radio frequency (rf) transmitter has been developed and demonstrated by the Oak Ridge National Laboratory. The objective of the rf transmitter development was to maximize the transmission distance while drastically shrinking the overall transmitter size, including antenna. Based on analysis and testing, an application-specific integrated circuit (ASIC) with a 16-GHz gallium arsenide (GaAs) oscillator and integrated on-chip antenna was designed and fabricated using microwave mo… more

Date: December 31, 1996

Creator: Crutcher, R. I.; Emery, M. S.; Falter, K. G.; Nowlin, C. H.; Rochelle, J. M. & Clonts, L. G.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Micromachined pressure sensors: Review and recent developments

Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuits industry, burrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyze the development of new markets. Given the emerging importance of MEMS, it is instruct… more

Date: March 1, 1997

Creator: Eaton, W. P. & Smith, J. H.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Surface-micromachined resonant accelerometer

This paper discusses the design and testing results of a resonant accelerometer developed for integrated surface-micromachining processes.First- and second-generation designs are presented. The sensors use leverage mechanisms to transfer force from a proof mass to double-ended tuning fork (DETF) resonators, used as force transducers. Each fork forms the basis of an integrated oscillator to provide the output waveforms. The DETF`s on the first-generation device have a nominal frequency of 175 kH… more

Date: April 2, 1997

Creator: Roessig, T. A.; Howe, R. T.; Pisano, A. P. & Smith, J. H.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Optical measurement of micromachine engine performance

Understanding the mechanisms that impact the performance of Microelectromechanical Systems (MEMS) is essential to the development of optimized designs and drive signals, as well as the qualification of devices for commercial applications. Silicon micromachines include engines that consist of orthogonally oriented linear comb drive actuators mechanically connected to a rotating gear. These gears are as small as 50 {mu}m in diameter and can be driven at rotation rates exceeding 300,000 rpm. Optic… more

Date: August 1, 1997

Creator: Holswade, S.C. & Dickey, F.M.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Gas-driven microturbine

This paper describes an invention which relates to microtechnology and the fabrication process for developing microelectrical systems. It describes a means for fabricating a gas-driven microturbine capable of providing autonomous propulsion in which the rapidly moving gases are directed through a micromachined turbine to power devices by direct linkage or turbo-electric generators components in a domain ranging from tenths of micrometers to thousands of micrometers.

Date: June 27, 1996

Creator: Sniegowski, J. J.; Rodgers, M. S.; McWhorter, P. J.; Aeschliman, D. P. & Miller, W. M.

Item Type: Patent

Partner: UNT Libraries Government Documents Department

open access

Assembly planning at the micro scale

This paper investigates a new aspect of fine motion planning for the micro domain. As parts approach 1--10 {micro}m or less in outside dimensions, interactive forces such as van der Waals and electrostatic forces become major factors which greatly change the assembly sequence and path plans. It has been experimentally shown that assembly plans in the micro domain are not reversible, motions required to pick up a part are not the reverse of motions required to release a part. This paper develops… more

Date: May 14, 1998

Creator: Feddema, J.T.; Xavier, P. & Brown, R.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Electrical and Fluidic Packaging of Surface Micromachined Electro-Microfluidic Devices

No Description Available.

Date: June 26, 2000

Creator: GALAMBOS,PAUL C. & BENAVIDES,GILBERT L.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Mechanical Testing of EPON SU-8 With SIEM

High aspect ratio structures are often present in MEMS devices and EPON SU-8 is often used to produce such structures because of its low cost. It is essential to know the mechanical properties of SU-8 for producing reliable MEMS products. However, the mechanical properties of SU-8 may depend on the manufacturing process and the size of the structure, which is in the micron domain. Hence, one needs to test specimens that are similar in size to MEMS structures to determine if the mechanical prope… more

Date: June 8, 2000

Creator: Chang, S.; Warren, J. & Chiang, F. P.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Adhesion hysteresis of silane coated microcantilevers

The authors have developed a new experimental approach for measuring hysteresis in the adhesion between micromachined surfaces. By accurately modeling the deformations in cantilever beams that are subject to combined interfacial adhesion and applied electrostatic forces, they determine adhesion energies for advancing and receding contacts. They draw on this new method to examine adhesion hysteresis for silane coated micromachined structures and found significant hysteresis for surfaces that wer… more

Date: April 17, 2000

Creator: DE BOER,MAARTEN P.; KNAPP,JAMES A.; MICHALSKE,TERRY A.; SRINIVASAN,U. & MABOUDIAN,R.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Applying Macro Design Tools to the Design of MEMS Accelerometers

This paper describes the design of two different surface micromachined (MEMS) accelerometers and the use of design and analysis tools intended for macro sized devices. This work leverages a process for integrating both the micromechanical structures and microelectronics circuitry of a MEMS accelerometer on the same chip. In this process, the mechanical components of the sensor are first fabricated at the bottom of a trench etched into the wafer substrate. The trench is then filled with oxide an… more

Date: February 1, 1998

Creator: Davies, B. R.; Rodgers, M. S. & Montague, S.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Nanosatellite program at Sandia National Laboratories

The concept of building extremely small satellites which, either independently or as a collective, can perform missions which are comparable to their much larger cousins, has fascinated scientists and engineers for several years now. In addition to the now commonplace microelectronic integrated circuits, the more recent advent of technologies such as photonic integrated circuits (PIC's) and micro-electromechanical systems (MEMS) have placed such a goal within their grasp. Key to the acceptance … more

Date: November 11, 1999

Creator: Reynolds, D.A.; Kern, J.P. & Schoeneman, J.L.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Single-step assembly of complex 3-D microstructures

This paper describes three-dimensional microstructures fabricated in a planar process and assembled in a single step. Multiple plates are constrained by hinges in such a way as to reduce the assembly process to a single degree-of-freedom of motion. Serial microassembly of these structures is simpler; moreover, self-assembly using hydrodynamic forces during release is much more feasible than with earlier, multiple degree-of-freedom hinged structures. A 250-{micro}m corner cube reflector, a 6-sid… more

Date: January 4, 2000

Creator: Hui, Elliot E.; Howe, Roger T. & Rodgers, M. Steven

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Rapid prototyping of patterned functional nanostructures

Living systems exhibit form and function on multiple length scales, and the prospect of imparting life-like qualities to man-made materials has inspired many recent efforts to devise hierarchical materials assembly strategies. For example, Yang et al. grew surfactant-templated mesoporous silica on hydrophobic patterns prepared by micro-contact printing {micro}CP{sup 3}. Trau et al. formed oriented mesoporous silica patterns, using a micro-molding in capillaries MIMIC technique, and Yang et al. … more

Date: February 9, 2000

Creator: Fan, Hongyou; Lu, Yunfeng; Stump, Aaron; Reed, Scott T.; Baer, Thomas A.; Schunk, P. Randall et al.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Designing microelectromechanical systems-on-a-chip in a 5-level surface micromachine technology

A new 5-level polysilicon surface micromachine process has been developed that offers significantly increased system complexity, while further promoting the manufacturability and reliability of microscopic mechanical systems. In general, as complexity increases, reliability suffers. This is not necessarily the case, however, with MicroElectroMechanical Systems (MEMS). In fact, utilizing additional levels of polysilicon in structures can greatly increase yield, reliability, and robustness. Surfa… more

Date: May 1, 1998

Creator: Rodgers, M.S. & Sniegowski, J.J.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Multi-Level Micromachined Systems-on-a-Chip: Technology and Applications

Researchers at Sandia have recently designed and built several research prototypes, which demonstrate that truly complex mechanical systems can now be realized in a surface micromachined technology. These MicroElectro- Mechanical Systems (MEMS) include advanced actuators, torque multiplying gear tmins, rack and pinion assemblies, positionable mirrors, and mechanical discriminators. All of tile mechanical components are batch fabricated on a single chip of silicon using the infrastructure origim… more

Date: October 27, 1998

Creator: Allen, J. J.; Krygowski, T. W.; Miller, S. L.; Montague, S.; Rodgers, M. S.; Smith, J. H. et al.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Challenges in the Packaging of MEMS

Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress… more

Date: September 24, 1999

Creator: BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD & SINGH, SUSHILA B.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories are presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Our efforts are concentrated in the area of surface micromachining. Pressure sensors based on silicon nitride diaphragms and hot polysilicon filaments for calorimetric gas sensing have been develo… more

Date: August 1, 1995

Creator: Smith, J.H.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Integration of electro-optical mechanical systems and medicine: Where are we and where can we go?

Microfabricated chip technologies offer researchers novel types of analysis of human clinical samples. Current examples of such technology include DNA amplification and analysis,and fluorescent cell analysis by flow cytometry. Potential applications include the development of rapid techniques for examining large numbers of cells in tissue or blood. This paper will outline criteria that successful devices must satisfy.

Date: March 1, 1997

Creator: Gourley, M. F. & Gourley, P. L.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology

Extracts basic mechanical properties such as Young's modulus and cantilever curvature.

Date: November 13, 2000

Creator: de Boer,Maarten P.; Smith,Norman F.; Masters, Nathan D.; Sinclair,Michael B. & Pryputniewicz,Emily J.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar a… more

Date: May 1, 1998

Creator: Sniegowski, J. & Rodgers, M.S.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

High performance microsystem packaging: A perspective

The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging desi… more

Date: October 1, 1997

Creator: Romig, A. D., Jr.; Dressendorfer, P. V. & Palmer, D. W.

Item Type: Article

Partner: UNT Libraries Government Documents Department