Search Results

Advanced search parameters have been applied.
open access

Conveyorized Photoresist Stripping Replacement for Flex Circuit Fabrication

Description: A replacement conveyorized photoresist stripping system was characterized to replace the ASI photoresist stripping system. This system uses the qualified ADF-25c chemistry for the fabrication of flex circuits, while the ASI uses the qualified potassium hydroxide chemistry. The stripping process removes photoresist, which is used to protect the copper traces being formed during the etch process.
Date: February 24, 2009
Creator: Donahue, Megan
Partner: UNT Libraries Government Documents Department
open access

The Impact of Emerging MEMS-Based Microsystems on US Defense Applications

Description: This paper examines the impact of inserting Micro-Electro-Mechanical Systems (MEMS) into US defense applications. As specific examples, the impacts of micro Inertial Measurement Units (IMUs), radio frequency MEMS (RF MEMS), and Micro-Opto-Electro-Mechanical Systems (MOEMS) to provide integrated intelligence, communication, and control to the defense infrastructure with increased affordability, functionality, and performance are highlighted.
Date: January 20, 2000
Creator: Staple, Bevan D. & Jakubczak, Jerome F., II
Partner: UNT Libraries Government Documents Department
open access

Infrastructure, Technology and Applications of Micro-Electro-Mechanical Systems (MEMS)

Description: A review is made of the infrastructure, technology and capabilities of Sandia National Laboratories for the development of micromechanical systems. By incorporating advanced fabrication processes, such as chemical mechanical polishing, and several mechanical polysilicon levels, the range of micromechanical systems that can be fabricated in these technologies is virtually limitless. Representative applications include a micro-engine driven mirror, and a micromachined lock. Using a novel integrat… more
Date: July 9, 1999
Creator: Allen, J. J.; Jakubczak, J. F.; Krygowski, T. W.; Miller, S. L.; Montague, S.; Rodgers, M. S. et al.
Partner: UNT Libraries Government Documents Department
open access

Intelligent Microsystems: Keys to the Next Silicon Revolution

Description: Paul McWhorter, Deputy Director for of the Microsystems Center at Sandia National Laboratories, discusses the potential of surface micromachining. A vision of the possibilities of intelligent Microsystems for the future is presented along with descriptions of several possible applications. Applications that are just around the corner and some that maybe quite a ways down the road but have a clear development path to their realization. Microsystems will drive the next silicon revolution.
Date: October 20, 1999
Creator: MCWHORTER,PAUL J.
Partner: UNT Libraries Government Documents Department
open access

Challenges in the Packaging of MEMS

Description: The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging… more
Date: March 26, 1999
Creator: Malshe, A. P.; Singh, S. B.; Eaton, W. P.; O'Neal, C.; Brown, W. D. & Miller, W. M.
Partner: UNT Libraries Government Documents Department
open access

Meso-scale machining capabilities and issues

Description: Meso-scale manufacturing processes are bridging the gap between silicon-based MEMS processes and conventional miniature machining. These processes can fabricate two and three-dimensional parts having micron size features in traditional materials such as stainless steels, rare earth magnets, ceramics, and glass. Meso-scale processes that are currently available include, focused ion beam sputtering, micro-milling, micro-turning, excimer laser ablation, femto-second laser ablation, and micro elect… more
Date: May 15, 2000
Creator: BENAVIDES,GILBERT L.; ADAMS,DAVID P. & YANG,PIN
Partner: UNT Libraries Government Documents Department
open access

MEMS Packaging - Current Issues and Approaches

Description: The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, un… more
Date: January 19, 2000
Creator: DRESSENDORFER,PAUL V.; PETERSON,DAVID W. & REBER,CATHLEEN ANN
Partner: UNT Libraries Government Documents Department
open access

Final Report: Free Standing Quantum Wells, August 15, 1996 - May 31, 1999

Description: Recent advances in microfabrication techniques in conjunction with the precise growth of layers of single crystalline materials by epitaxial growth techniques allow the creation of new electro-optic microstructures. We have selectively etched compositionally modulated 111-v heterostructures to produce quantum wells (QW's) which are confined on both sides by air or vacuum. The material is patterned so to have the QW's suspended horizontally between vertical support posts. This structure is ideal… more
Date: October 11, 1999
Creator: Williams, M. D.; Lee, H. W. H. & Collins, J.
Partner: UNT Libraries Government Documents Department
open access

Development of lead-free solders for hybrid microcircuits

Description: Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring … more
Date: January 1, 1996
Creator: Hosking, F. M.; Vianco, P. T.; Frear, D. R. & Robinson, D. G.
Partner: UNT Libraries Government Documents Department
open access

Monolithic Active Pixel Matrix with Binary Counters in an SOI Process

Description: The design of a Prototype monolithic active pixel matrix, designed in a 0.15 {micro}m CMOS SOI Process, is presented. The process allowed connection between the electronics and the silicon volume under the layer of buried oxide (BOX). The small size vias traversing through the BOX and implantation of small p-type islands in the n-type bulk result in a monolithic imager. During the acquisition time, all pixels register individual radiation events incrementing the counters. The counting rate is u… more
Date: June 7, 2007
Creator: Duptuch, G. & Yarema, R.
Partner: UNT Libraries Government Documents Department
open access

The Sandia MEMS Passive Shock Sensor : dormancy and aging.

Description: This report presents the results of an aging experiment that was established in FY09 and completed in FY10 for the Sandia MEMS Passive Shock Sensor. A total of 37 packages were aged at different temperatures and times, and were then tested after aging to determine functionality. Aging temperatures were selected at 100 C and 150 C, with times ranging from as short as 100 hours to as long as 1 year to simulate a predicted aging of up to 20 years. In all of the tests and controls, 100% of the devi… more
Date: December 1, 2010
Creator: Baker, Michael Sean & Tanner, Danelle Mary
Partner: UNT Libraries Government Documents Department
open access

A Unitifed Computational Approach to Oxide Aging Processes

Description: In this paper we describe a unified, hierarchical computational approach to aging and reliability problems caused by materials changes in the oxide layers of Si-based microelectronic devices. We apply this method to a particular low-dose-rate radiation effects problem
Date: January 27, 1999
Creator: Bowman, D. J.; Fleetwood, D. M.; Hjalmarson, H. P. & Schultz, P. A.
Partner: UNT Libraries Government Documents Department
open access

High reliability plastic packaging for microelectronics

Description: Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testing. The test circuits on the ATC02.5 chip were very sensitive to extrinsic or processing induced failure rates. Accelerated aging experiments were conducted with unpassivated triple track Al structures on the ATC02.6 chip; the unpassivated tracks wer… more
Date: July 1, 1997
Creator: Sweet, J.N.; Peterson, D.W.; Hsia, A.H. & Tuck, M.
Partner: UNT Libraries Government Documents Department
open access

Ultra-Precise Assembly of Micro-Electromechanical Systems (MEMS) Components

Description: This report summarizes a three year effort to develop an automated microassembly workcell for the assembly of LIGA (Lithography Galvonoforming Abforming) parts. Over the last several years, Sandia has developed processes for producing surface machined silicon and LIGA parts for use in weapons surety devices. Some of these parts have outside dimensions as small as 100 micron, and most all have submicron tolerances. Parts this small and precise are extremely difficult to assembly by hand. Therefo… more
Date: April 1, 1999
Creator: Feddema, J.T.; Simon, R.; Polosky, M. & Christenson, T.
Partner: UNT Libraries Government Documents Department
open access

Resists for next generation lithography

Description: Four Next Generation Lithographic options (EUV, x-ray, EPL, IPL) are compared against four current optical technologies (i-line, DUV, 193 nm, 157 nm) for resolution capabilities based on wavelength. As the wavelength of the incident radiation decreases, the nature of the interaction with the resist changes. At high energies, optical density is less sensitive to molecular structure then at 157 nm.
Date: October 3, 2001
Creator: Brainard, Robert L.; Barclay, George G.; Anderson, Erik H. & Ocola, Leonidas E.
Partner: UNT Libraries Government Documents Department
open access

Pressure Waves Induced by Megasonic Agitation in a LIGA Development Tank

Description: Megasonic agitation is used to improve the uniformity of the LIGA{sup 1} development process. To investigate the acoustic wave fields induced by megasonic agitation, we compute wave fields for a development tank containing a submerged wafer and for a typical trench-like feature on the wafer face. This separate treatment of these two problems is advantageous, because the length scales of the tank and the feature differ by three to four orders of magnitude. A spectral method based on Green's func… more
Date: August 1, 2002
Creator: Ting, Aili
Partner: UNT Libraries Government Documents Department
open access

Moisture and aging effects of solder wettability of copper surfaces

Description: Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify sol… more
Date: December 1, 1996
Creator: Hernandez, C. L.; Sorensen, N. R. & Lucero, S. J.
Partner: UNT Libraries Government Documents Department
open access

End-point process development for low-volume, high reliability tungsten CMP

Description: A temperature end point method was developed for tungsten CMP (WCMP) processing in the Sandia Microelectronics Development Laboratory (MDL), a facility which develops and prototypes a variety of silicon based devices including ASIC, memory, radiation hardened CMOS and microelectromechanical systems. A large product variety and small production lot size prevents process recipe optimization or standardization for each mask level and product. Rigorous product reliability requirements and prohibiti… more
Date: December 1, 1997
Creator: Merkle, P.B. & Myers, T.L.
Partner: UNT Libraries Government Documents Department
open access

Development of a hybrid microcircuit test vehicle for surface mount applications

Description: The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental concerns. Surface mount technology (SMT) has evolved in response to these issues. Prototype hybrid test vehicles have been developed at Sandia National Laboratories to evaluate three lead-free solders for Au-Pt-Pd thick film soldering. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Populated test vehicles … more
Date: August 1, 1997
Creator: Hernandez, C. L.; Hosking, F. M. & Vianco, P. T.
Partner: UNT Libraries Government Documents Department
open access

Applying Macro Design Tools to the Design of MEMS Accelerometers

Description: This paper describes the design of two different surface micromachined (MEMS) accelerometers and the use of design and analysis tools intended for macro sized devices. This work leverages a process for integrating both the micromechanical structures and microelectronics circuitry of a MEMS accelerometer on the same chip. In this process, the mechanical components of the sensor are first fabricated at the bottom of a trench etched into the wafer substrate. The trench is then filled with oxide an… more
Date: February 1, 1998
Creator: Davies, B. R.; Rodgers, M. S. & Montague, S.
Partner: UNT Libraries Government Documents Department
Back to Top of Screen