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Three Dimensional, Multi-Chip Module

Description: The present invention relates to integrated circuit packaging technology, and particularly to three dimensional packages involving high density stacks of integrated circuits. A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the… more
Date: December 31, 1992
Creator: Bernhardt, A. F. & Petersen, R. W.
Item Type: Refine your search to only Patent
Partner: UNT Libraries Government Documents Department
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IMAP: Interferometry for Material Property Measurement in MEMS

Description: An interferometric technique has been developed for non-destructive, high-confidence, in-situ determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for determining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as suppo… more
Date: March 10, 1999
Creator: Jensen, B. D.; Miller, S. L. & de Boer, M. P.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Development of a micropump for microelectronic cooling

Description: To demonstrate a system integration process for Micro-Electro-Mechanical Systems (MEMS), we are building an active cooling MEMS unit for microelectronics applications. This integrated unit will incorporate a micropump, temperature sensors, microchannels, and heat exchange devices into a single unit. The first phase of this research project is to develop and test a micropump capable of moving the working fluid within the integrated device. This paper will discuss the design, development, testing… more
Date: October 1, 1996
Creator: Wong, C. C.; Adkins, D. R. & Chu, Dahwey
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Designing microelectromechanical systems-on-a-chip in a 5-level surface micromachine technology

Description: A new 5-level polysilicon surface micromachine process has been developed that offers significantly increased system complexity, while further promoting the manufacturability and reliability of microscopic mechanical systems. In general, as complexity increases, reliability suffers. This is not necessarily the case, however, with MicroElectroMechanical Systems (MEMS). In fact, utilizing additional levels of polysilicon in structures can greatly increase yield, reliability, and robustness. Surfa… more
Date: May 1, 1998
Creator: Rodgers, M.S. & Sniegowski, J.J.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

Description: An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories are presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Our efforts are concentrated in the area of surface micromachining. Pressure sensors based on silicon nitride diaphragms and hot polysilicon filaments for calorimetric gas sensing have been develo… more
Date: August 1, 1995
Creator: Smith, J.H.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

Description: An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar a… more
Date: May 1, 1998
Creator: Sniegowski, J. & Rodgers, M.S.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Fundamentals of embossing nanoimprint lithography in polymer substrates.

Description: The convergence of micro-/nano-electromechanical systems (MEMS/NEMS) and biomedical industries is creating a need for innovation and discovery around materials, particularly in miniaturized systems that use polymers as the primary substrate. Polymers are ubiquitous in the microelectronics industry and are used as sensing materials, lithography tools, replication molds, microfluidics, nanofluidics, and biomedical devices. This diverse set of operational requirements dictates that the materials e… more
Date: February 1, 2011
Creator: Simmons, Blake Alexander & King, William P. (University of Illinois, Urbana IL)
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Integrated circuits: Resistless processing simplifies production and cuts costs

Description: Reducing the complexity and cost of producing deep-submicrometer integrated circuits (ICs) will soon be possible using a revolutionary approach being developed at the Lawrence Livermore National Laboratory (LLNL). Resistless Projection Doping (RPD) will eliminate the need for photoresist processing during the impurity doping step. This single innovation will reduce the doping sequence from 13 steps to 1 and eliminate the need for five pieces of capital equipment costing more than $5 million. Th… more
Date: March 25, 1993
Creator: Weiner, K.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Microsystem technology development at Sandia National Laboratories

Description: An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has also been developed for integrating microelectronics with surface micromachined micromechanical d… more
Date: November 1, 1995
Creator: Smith, J.H.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Calibration of an interfacial force microscope for MEMS metrology : FY08-09 activities.

Description: Progress in MEMS fabrication has enabled a wide variety of force and displacement sensing devices to be constructed. One device under intense development at Sandia is a passive shock switch, described elsewhere (Mitchell 2008). A goal of all MEMS devices, including the shock switch, is to achieve a high degree of reliability. This, in turn, requires systematic methods for validating device performance during each iteration of design. Once a design is finalized, suitable tools are needed to prov… more
Date: October 1, 2009
Creator: Houston, Jack E.; Baker, Michael Sean; Crowson, Douglas A.; Mitchell, John Anthony & Moore, Nathan W.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Micromachined sensor and actuator research at the Microelectronics Development Laboratory

Description: An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories is presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Surface micromachining is the predominant technology under development. Pressure sensors based on silicon nitride diaphragms have been developed. Hot polysilicon filaments for calorimetric gas sens… more
Date: December 1994
Creator: Smith, J. H.; Barron, C. C.; Fleming, J. G.; Montague, S.; Rodriguez, J. L.; Smith, B. K. et al.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Deposition of field emissions cathodes over large areas

Description: Field emission cathodes (FECs) with characteristics of cold emission, low voltage operation, high current density and microscopic size meet the requirements for an electron source for use in vacuum microelectronics. Deposition efforts have focused on evaporation techniques, as electron beam, to produce the size and shape of cathode required for efficient operation. After two decades of development, the convention for FEC synthesis involves coating with very high tolerances for thickness uniform… more
Date: April 3, 1997
Creator: Jankowski, Alan Frederic & Hayes, Jeffrey P.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Fabrication and testing of optics for EUV projection lithography

Description: Extreme Ultraviolet Lithography (EUVL) is a leading candidate as a stepper technology for fabricating the ``0.1 {micro}m generation`` of microelectronic circuits. EUVL is an optical printing technique qualitatively similar to Deep UV Lithography (DUVL), except that 11-13nm wavelength light is used instead of 193-248nm. The feasibility of creating 0.l{micro}m features has been well-established using small-field EWL printing tools, and development efforts are currently underway to demonstrate tha… more
Date: March 13, 1998
Creator: Taylor, J. S.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Automation, Control and Modeling of Compound Semiconductor Thin-Film Growth

Description: This report documents the results of a laboratory-directed research and development (LDRD) project on control and agile manufacturing in the critical metalorganic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE) materials growth processes essential to high-speed microelectronics and optoelectronic components. This effort is founded on a modular and configurable process automation system that serves as a backbone allowing integration of process-specific models and sensors. We h… more
Date: February 1, 1999
Creator: Coltrin, Michael E.; Klem, John F.; Hou, Hong Q.; Breiland, W. G.; Drummond, Timothy J.; Horn, Kevin M. et al.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS

Description: Recently, a great deal of interest has developed in manufacturing processes that allow the monolithic integration of MicroElectroMechanical Systems (MEMS) with driving, controlling, and signal processing electronics. This integration promises to improve the performance of micromechanical devices as well as lower the cost of manufacturing, packaging, and instrumenting these devices by combining the micromechanical devices with a electronic devices in the same manufacturing and packaging process.… more
Date: October 1, 1996
Creator: Smith, J.H.; Montague, S.; Sniegowski, J.J. & Murray, J.R.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Non-Shrinking Sol-Gel Type Polymers by Ring Opening Polymerizations

Description: We have designed a new class of cyclic siloxane compounds that behave as sol-gel systems when ring open polymerized using a hydroxide base. These monomers polymerize through chain growth polymerization. unlike conventional alkoxysilane sol-gel precursors, to form sol-gel polymers. They do not require solvent or water for polymerization, show no visible shrinkage or cracking during polymerization and are thermally stable. We have successfully utilized these materials in encapsulation of microele… more
Date: April 5, 1999
Creator: Loy, D.A. & Rahimian, K.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Integrated micro-electro-mechanical sensor development for inertial applications

Description: Electronic sensing circuitry and micro electro mechanical sense elements can be integrated to produce inertial instruments for applications unheard of a few years ago. This paper will describe the Sandia M3EMS fabrication process, inertial instruments that have been fabricated, and the results of initial characterization tests of micro-machined accelerometers.
Date: April 1, 1998
Creator: Allen, J. J.; Kinney, R. D. & Sarsfield, J.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Microsensors to monitor missile storage and maintenance needs

Description: Accurate assessments of reliability and condition based maintenance can only be implemented where a good understanding of ammunition stockpile condition exists. Use of miniaturized intelligent sensors provides an inexpensive means of nondestructively gaining insight into stockpile condition while keeping costs low. In the past, evaluation of ammunition lifetimes has utilized humidity, temperature, pressure, shock, and corrosion. New technologies provide the possibility of obtaining these enviro… more
Date: October 30, 1997
Creator: Mee, D. K.; Thundat, T. G. & Oden, P. I.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Deep high-aspect ratio Si etching for advanced packaging technologies

Description: Deep high-aspect ratio Si etching (HARSE) has shown potential application for passive self-alignment of dissimilar materials and devices on Si carriers or waferboards. The Si can be etched to specific depths and; lateral dimensions to accurately place or locate discrete components (i.e lasers, photodetectors, and fiber optics) on a Si carrier. It is critical to develop processes which maintain the dimensions of the mask, yield highly anisotropic profiles for deep features, and maintain the anis… more
Date: May 1, 1998
Creator: Shul, R.J.; Willison, C.G.; Sullivan, C.T.; Kravitz, S.H.; Zhang, L. & Zipperian, T.E.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Microchannel cooling of face down bounded chips

Description: The present invention relates to cooling high power integrated circuits; and particularly to microchannel cooling of integrated circuits bonded face down on circuit boards, such as by flip-chip bonding. Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stac… more
Date: December 1992
Creator: Bernhardt, A. F.
Item Type: Refine your search to only Patent
Partner: UNT Libraries Government Documents Department
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