Liquid-film assisted formation of alumina/niobium interfaces
Description:
Alumina has been joined at 1400 degrees C using niobium-based interlayers. Two different joining approaches were compared: solid-state diffusion bonding using a niobium foil as an interlayer, and liquid-film assisted bonding using a multilayer copper/niobium/copper interlayer. In both cases, a 127-(mu)m thick niobium foil was used; =1.4-(mu)m or =3-(mu)m thick copper films flanked the niobium. Room-temperature four-point bend tests showed that the introduction of a copper film had a significant…
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Date:
June 16, 2002
Creator:
Sugar, Joshua D.; McKeown, Joseph T.; Marks, Robert A. & Glaeser, Andreas M.
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UNT Libraries Government Documents Department