LDRD final report backside localization of open and shorted IC interconnections LDRD Project (FY98 and FY 99)
Description:
Two new failure analysis techniques have been developed for backside and front side localization of open and shorted interconnections on ICs. These scanning optical microscopy techniques take advantage of the interactions between IC defects and localized heating using a focused infrared laser ({lambda} = 1,340 nm). Images are produced by monitoring the voltage changes across a constant current supply used to power the IC as the laser beam is scanned across the sample. The methods utilize the Se…
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Date:
January 1, 2000
Creator:
Cole, E. I., Jr.; Tangyunyong, P.; Benson, D. A. & Barton, D. L.
Item Type:
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Report
Partner:
UNT Libraries Government Documents Department