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Ion Beam Synthesis of Carbon Assisted Nanosystems in Silicon Based Substrates

Description: The systematic study of the formation of β-SiC formed by low energy carbon ion (C-)implantation into Si followed by high temperature annealing is presented. The research is performed to explore the optimal annealing conditions. The formation of crystalline β-SiC is clearly observed in the sample annealed at 1100 °C for a period of 1 hr. Quantitative analysis is performed in the formation of β-SiC by the process of implantation of different carbon ion fluences of 1×1017, 2×1017, 5×1017, and 8×1017 atoms /cm2 at an ion energy of 65 keV into Si. It is observed that the average size of β-SiC crystals decreased and the amount of β-SiC crystals increased with the increase in the implanted fluences when the samples were annealed at 1100°C for 1 hr. However, it is observed that the amount of β-SiC linearly increased with the implanted fluences up to 5×1017 atoms /cm2. Above this fluence the amount of β-SiC appears to saturate. The stability of graphitic C-C bonds at 1100°C limits the growth of SiC precipitates in the sample implanted at a fluence of 8×1017 atoms /cm2 which results in the saturation behavior of SiC formation in the present study. Secondly, the carbon cluster formation process in silica and the characterization of formed clusters is presented. Silicon dioxide layers ~500 nm thick are thermally grown on a Si (100) wafer. The SiO2 layers are then implanted with 70 keV carbon ions at a fluence of 5×1017 atoms/cm2. The implanted samples are annealed 1100 °C for different time periods of 10 min., 30 min., 60 min., 90 min., and 120 min., in the mixture of argon and hydrogen gas (96 % Ar + 4% hydrogen). Photoluminescence spectroscopy reveals UV to visible emission from the samples. A detail mechanism of the photoluminescence and its possible origin is discussed ...
Date: May 2011
Creator: Poudel, Prakash Raj
Partner: UNT Libraries

Microstructure studies of silicon-on-insulator for very large scale integrated circuit applications

Description: Silicon-on-insulator formed by high dose oxygen ion implantation and subsequent epitaxially grown silicon layers were studied and compared with silicon on sapphire materials. Czochralski grown, (100) silicon wafers were implanted with molecular oxygen ions, 0+2, to a total dose of 2.12 x 10^18 0+/cm^2 at an energy of 150 keV/atom.
Date: December 1982
Creator: Hamdi, Aboud Helal
Partner: UNT Libraries

Investigation of Structural and Optical Properties of Ag Nanoclusters Formed in Si(100) After Multiple Implantations of Low Energies Ag Ions and Post-Thermal Annealing at a Temperature Below the Ag-Si Eutectic Point

Description: This paper investigates the synthesis of Ag NCs in Si(100) substrate by implanting multiple energies and fluences of Ag ions and subsequent thermal annealing.
Date: April 2, 2014
Creator: Dhoubhadel, Mangal; Rout, Bibhudutta; Lakshantha, Wickramaarachchige J.; Das, Sushanta K.; D'Souza, Francis; Glass, Gary A. et al.
Partner: UNT College of Arts and Sciences

Structure and Properties of Nanoparticles Formed by Ion Implantation

Description: This chapter broadly describes the formation, basic microstructure, and fundamental optoelectronic properties of nanocomposites synthesized by ion implantation. It is not meant as a complete literature survey and by no means includes all references on a subject that has seen a considerable amount of research effort in the past 15 years. However, it should be a good starting point for those new to the field and in a concise way summarize the main lines of research by discussing the optical, magnetic, and smart properties of these nanoparticles and the dependence of these properties on the overall microstructure. The chapter concludes with an outlook for the future.
Date: January 1, 2009
Creator: Meldrum, A.; Lopez, R.; Magruder, R H; Boatner, Lynn A & White, Clark W
Partner: UNT Libraries Government Documents Department

In-situ deposition of sacrificial layers during ion implantation

Description: The retained dose of implanted ions is limited by sputtering. It is known that a sacrificial layer deposited prior to ion implantation can lead to an enhanced retained dose. However, a higher ion energy is required to obtain a similar implantation depth due to the stopping of ions in the sacrificial layer. It is desirable to have a sacrificial layer of only a few monolayers thickness which can be renewed after it has been sputtered away. We explain the concept and describe two examples: (i) metal ion implantation using simultaneously a vacuum arc ion source and filtered vacuum arc plasma sources, and (ii) Metal Plasma Immersion Ion Implantation and Deposition (MePIIID). In MePIIID, the target is immersed in a metal or carbon plasma and a negative, repetitively pulsed bias voltage is applied. Ions are implanted when the bias is applied while the sacrificial layer suffers sputtering. Low-energy thin film deposition - repair of the sacrificial layer -- occurs between bias pulses. No foreign atoms are incorporated into the target since the sacrificial film is made of the same ion species as used in the implantation phase.
Date: February 1, 1995
Creator: Anders, A.; Anders, S.; Brown, I. G. & Yu, K. M.
Partner: UNT Libraries Government Documents Department

Investigation of Selected Optically-Active Nanosystems Fashioned using Ion Implantation

Description: Opto-electronic semiconductor technology continues to grow at an accelerated pace, as the industry seeks to perfect devices such as light emitting diodes for purposes of optical processing and communication. A strive for greater efficiency with shrinking device dimensions, continually pushes the technology from both a design and materials aspect. Nanosystems such a quantum dots, also face new material engineering challenges as they enter the realm of quantum mechanics, with each system and material having markedly different electronic properties. Traditionally, the semiconductor industry has focused on materials such Group II-VI and III-V compounds as the basis material for future opto-electronic needs. Unfortunately, these material systems can be expensive and have difficulties integrating into current Si-based technology. The industry is reluctant to leave silicon due in part to silicon's high quality oxide, and the enormous amount of research invested into silicon based circuit fabrication. Although recently materials such as GaN are starting to dominate the electro-optical industry since a Si-based substitute has not been found. The purpose of the dissertation was to examine several promising systems that could be easily integrated into current Si-based technology and also be produced using simple inexpensive fabrication techniques such ion implantation. The development of optically active nano-sized precipitates in silica to form the active layer of an opto-electronic device was achieved with ion implantation and thermal annealing. Three material systems were investigated. These systems consisted of carbon, silicon and metal silicide based nanocrystals. The physical morphology and electronic properties were monitored using a variety of material characterization techniques. Rutherford backscattering/channeling were used to monitor elemental concentrations, photoluminescence was used to monitor the opto-electronic properties and transmission electron microscopy was used to study the intricate morphology of individual precipitates. The electronic properties and the morphology were studied as a function of implant dose, anneal times and anneal ...
Date: May 2006
Creator: Mitchell, Lee
Partner: UNT Libraries

Ion Implantation with Scanning Probe Alignment

Description: We describe a scanning probe instrument which integrates ion beams with the imaging and alignment function of a piezo-resistive scanning probe in high vacuum. The beam passes through several apertures and is finally collimated by a hole in the cantilever of the scanning probe. The ion beam spot size is limited by the size of the last aperture. Highly charged ions are used to show hits of single ions in resist, and we discuss the issues for implantation of single ions.
Date: July 12, 2005
Creator: Persaud, A.; Liddle, J.A.; Schenkel, T.; Bokor, J.; Ivanov, Tzv. & Rangelow, I.W.
Partner: UNT Libraries Government Documents Department

Influence of Annealing Conditions on Dopant Antirotation of Si+ and Mg+ Implanted GaN

Description: This report reflects the results of heat treatment under various conditions on as-grown and ion implanted GaN. The PL spectrums of as-grown GaN and GaN with 400 A AlN cap were almost identical. This fact allows one to use PL analysis without AlN stripping. As-grown GaN and ion implanted with Mg and Si crystals were annealed at 1300 C for 10 minutes in three different conditions: in flowing argon gas; in flowing ultra high purity nitrogen; and in a quartz capsule sealed with nitrogen gas. The results of PL, RBS, SEM and TEM analysis show an advantage of GaN high temperature annealing in quartz capsules with nitrogen ambient as compared to annealing in argon and nitrogen gas flow. Encapsulation with nitrogen over-pressure prevents the decomposition of the GaN crystal and the AlN capping film, and allows one to achieve optical activation of implanted Mg and Si after 1300 C annealing.
Date: October 12, 1999
Creator: Suvkhanov, A.; Parikh, N.; Usov, I.; Hunn, J.D.; Withrow, S.; Thomson, D. et al.
Partner: UNT Libraries Government Documents Department


Description: The joint research and development program is continued to develop steady-state ion source of decaborane beam for ion implantation industry. Bemas ion source is the wide used ion source for ion implantation industry. The new simulation code was developed for the Bemas ion source discharge simulation. We present first results of the simulation for several materials interested in semiconductors. As well the comparison of results obtained with experimental data obtained at the ITEP ion source test-bench is presented.
Date: August 26, 2007
Partner: UNT Libraries Government Documents Department

Stable, free-standing Ge nanocrystals

Description: Free-standing Ge nanocrystals that are stable under ambient conditions have been synthesized in a two-step process. First, nanocrystals with a mean diameter of 5 nm are grown in amorphous SiO{sub 2} by ion implantation followed by thermal annealing. The oxide matrix is then removed by selective etching in diluted HF to obtain free-standing nanocrystals on a Si wafer. After etching, nanocrystals are retained on the surface and the size distribution is not significantly altered. Free-standing nanocrystals are stable under ambient atmospheric conditions, suggesting formation of a self-limiting native oxide layer. For free-standing as opposed to embedded Ge nanocrystals, an additional amorphous-like contribution to the Raman spectrum is observed and is assigned to surface reconstruction-induced disordering of near-surface atoms.
Date: January 28, 2005
Creator: Sharp, I.D.; Xu, Q.; Liao, C.Y.; Yi, D.O.; Beeman, J.W.; Liliental-Weber, Z. et al.
Partner: UNT Libraries Government Documents Department

Ion Beam Materials Analysis and Modifications At keV to MeV Energies at the University of North Texas

Description: This paper provides an overview of the Ion Beam Modification and Analysis Laboratory facilities and some of the current research projects.
Date: February 25, 2014
Creator: Rout, Bibhudutta; Dhoubhadel, Mangal; Poudel, Prakash R.; Kummari, Venkata C.; Lakshantha, Wickramaarachchige J.; Manuel, J. E. et al.
Partner: UNT College of Arts and Sciences

A Novel Process for GeSi Thin Film Synthesis

Description: A unique process of fabricating a strained layer GexSi1-x on insulator is demonstrated. Such strained heterostructures are useful in the fabrication of high-mobility transistors. This technique incorporates well-established silicon processing technology e.g., ion implantation and thermal oxidation. A dilute GeSi layer is initially formed by implanting Ge+ into a silicon-on-insulator (SOI) substrate. Thermal oxidation segregates the Ge at the growing oxide interface to form a distinct GexSi1-x thin-film with a composition that can be tailored by controlling the oxidation parameters (e.g. temperature and oxidation ambient). In addition, the film thickness can be controlled by implantation fluence, which is important since the film forms pseudomorphically below 2×1016 Ge/cm2. Continued oxidation consumes the underlying Si leaving the strained GeSi film encapsulated by the two oxide layers, i.e. the top thermal oxide and the buried oxide. Removal of the thermal oxide by a dilute HF etch completes the process. Strain relaxation can be achieved by either of two methods. One involves vacancy injection by ion implantation to introduce sufficient open-volume within the film to compensate for the compressive strain. The other depends upon the formation of GeO2. If Ge is oxidized in the absence of Si, it evaporates as GeO(g) resulting in spontaneous relaxation within the strained film. Conditions under which this occurs have been discussed along with elaborated results of oxidation kinetics of Ge-ion implanted silicon. Rutherford backscattering spectrometry (RBS), ion channeling, Raman spectroscopy and scanning electron microscopy (SEM) were used as the characterization techniques.
Date: December 2007
Creator: Hossain, Khalid
Partner: UNT Libraries

Oxidation of silicon implanted with high-dose aluminum

Description: Si(100) wafers were implanted with Al at 500 C to high doses at multi-energies and were oxidized in 1 atm flowing oxygen at 1000-1200 C. Morphology, structure, and oxidation behavior of the implanted and oxidized Si were studied using optical microscopy, atomic force microscopy, and cross-sectional transmission electron microscopy in conjunction with selected area electron diffraction and energy dispersive x-ray analysis. Large Al precipitates were formed and embedded near the surface region of the implanted Si. Oxidation rate of the Al-implanted Si wafers was lower than that of virgin Si. The unique morphology of the implanted Si results from rpaid Al diffusion and segregation promoted by hot implantation. Reduction of the oxidation rate of Si by Al implantation is attributed to preferential oxidation of Al and formation of a continuous diffusion barrier of Al{sub 2}O{sub 3}.
Date: December 31, 1994
Creator: Yang, Zunde; Du, Honghua & Withrow, S.P.
Partner: UNT Libraries Government Documents Department

Annealing studies of visible light emission from silicon nanocrystals produced by implantation

Description: The annealing behavior of silicon implanted SiO{sub 2} layers is studied using continuous and time-gated photoluminescence (PL). Two PL emission bands are observed. A band centered at 560 nm is present in as implanted samples and it is still observed after 1000 {degrees}C annealing. The emission time is fast (0.2 -2 ns). A second band centered at 780 nm further increases when hydrogen annealing was performed. The emission time is long (1 {mu}s - 0.3 ms).
Date: December 31, 1996
Creator: Ghislotti, G.; Nielsen, B. & Di Mauro, L.F.
Partner: UNT Libraries Government Documents Department

Extreme Precipitation Strengthening in Ion-Implanted Nickel

Description: Precipitation strengthening of nickel was investigated using ion-implantation alloying and nanoindentation testing for particle separations in the nanometer range and volume fractions extending above 10O/O. Ion implantation of either oxygen alone or oxygen plus aluminum at room temperature was shown to produce substantial strengthening in the ion-treated layer, with yield strengths near 5 GPa in both cases. After annealing to 550"C the oxygen-alone layer loses much of the benefit, with its yield strength reduced to 1.2 GP~ but the dual ion-implanted layer retains a substantially enhanced yield strength of over 4 GPa. Examination by transmission electron f microscopy showed very fine dispersions of 1-5 nm diameter NiO and y-A1203 precipitates in the implanted layers before annealing. The heat treatment at 550"C induced ripening of the NiO particles to sizes ranging from 7 to 20 nm, whereas the more stable ~-A1203 precipitates were little changed. The extreme strengthening we observe is in semiquantitative agreement with predictions based on the application of dispersion-hardening theory to these microstructure.
Date: May 3, 1999
Creator: Follstaedt, D.M.; Knapp, J.A.; Myers, S.M. & Petersen, G.A.
Partner: UNT Libraries Government Documents Department