Electrochemical Study of Under-Potential Deposition Processes on Transition Metal Surfaces
Description:
Copper under-potential deposition (UPD) on iridium was studied due to important implications it presents to the semiconductor industry. Copper UPD allows controlled superfilling on sub-micrometer trenches; iridium has characteristics to prevent copper interconnect penetration into the surrounding dielectric. Copper UPD is not favored on iridium oxides but data shows copper over-potential deposition when lower oxidation state Ir oxide is formed. Effect of anions in solution on silver UPD at plat…
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Date:
August 2006
Creator:
Flores Araujo, Sarah Cecilia
Partner:
UNT Libraries