Description: A replacement conveyorized photoresist stripping system was characterized to replace the ASI photoresist stripping system. This system uses the qualified ADF-25c chemistry for the fabrication of flex circuits, while the ASI uses the qualified potassium hydroxide chemistry. The stripping process removes photoresist, which is used to protect the copper traces being formed during the etch process.
Date: February 24, 2009
Creator: Donahue, Megan
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department