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Meso-scale controlled motion for a microfluidic drop ejector.

Description: The objective of this LDRD was to develop a uniquely capable, novel droplet solution based manufacturing system built around a new MEMS drop ejector. The development all the working subsystems required was completed, leaving the integration of these subsystems into a working prototype still left to accomplish. This LDRD report will focus on the three main subsystems: (1) MEMS drop ejector--the MEMS ''sideshooter'' effectively ejected 0.25 pl drops at 10 m/s, (2) packaging--a compact ejector package based on a modified EMDIP (Electro-Microfluidic Dual In-line Package--SAND2002-1941) was fabricated, and (3) a vision/stage system allowing precise ejector package positioning in 3 dimensions above a target was developed.
Date: December 1, 2004
Creator: Galambos, Paul C.; Givler, Richard C.; Pohl, Kenneth Roy; Czaplewski, David A.; Luck, David L.; Braithwaite, Mark J. et al.
Partner: UNT Libraries Government Documents Department

GBL-2D Version 1.0: a 2D geometry boolean library.

Description: This report describes version 1.0 of GBL-2D, a geometric Boolean library for 2D objects. The library is written in C++ and consists of a set of classes and routines. The classes primarily represent geometric data and relationships. Classes are provided for 2D points, lines, arcs, edge uses, loops, surfaces and mask sets. The routines contain algorithms for geometric Boolean operations and utility functions. Routines are provided that incorporate the Boolean operations: Union(OR), XOR, Intersection and Difference. A variety of additional analytical geometry routines and routines for importing and exporting the data in various file formats are also provided. The GBL-2D library was originally developed as a geometric modeling engine for use with a separate software tool, called SummitView [1], that manipulates the 2D mask sets created by designers of Micro-Electro-Mechanical Systems (MEMS). However, many other practical applications for this type of software can be envisioned because the need to perform 2D Boolean operations can arise in many contexts.
Date: November 1, 2006
Creator: McBride, Cory L. (Elemental Technologies, American Fort, UT); Schmidt, Rodney Cannon; Yarberry, Victor R. & Meyers, Ray J. (Elemental Technologies, American Fort, UT)
Partner: UNT Libraries Government Documents Department

Validation of thermal models for a prototypical MEMS thermal actuator.

Description: This report documents technical work performed to complete the ASC Level 2 Milestone 2841: validation of thermal models for a prototypical MEMS thermal actuator. This effort requires completion of the following task: the comparison between calculated and measured temperature profiles of a heated stationary microbeam in air. Such heated microbeams are prototypical structures in virtually all electrically driven microscale thermal actuators. This task is divided into four major subtasks. (1) Perform validation experiments on prototypical heated stationary microbeams in which material properties such as thermal conductivity and electrical resistivity are measured if not known and temperature profiles along the beams are measured as a function of electrical power and gas pressure. (2) Develop a noncontinuum gas-phase heat-transfer model for typical MEMS situations including effects such as temperature discontinuities at gas-solid interfaces across which heat is flowing, and incorporate this model into the ASC FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (3) Develop a noncontinuum solid-phase heat transfer model for typical MEMS situations including an effective thermal conductivity that depends on device geometry and grain size, and incorporate this model into the FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (4) Perform combined gas-solid heat-transfer simulations using Calore with these models for the experimentally investigated devices, and compare simulation and experimental temperature profiles to assess model accuracy. These subtasks have been completed successfully, thereby completing the milestone task. Model and experimental temperature profiles are found to be in reasonable agreement for all cases examined. Modest systematic differences appear to be related to uncertainties in the geometric dimensions of the test structures and in the thermal conductivity of the polycrystalline silicon test structures, as well as uncontrolled nonuniform changes in this quantity over time and during operation.
Date: September 1, 2008
Creator: Gallis, Michail A.; Torczynski, John Robert; Piekos, Edward Stanley; Serrano, Justin Raymond; Gorby, Allen D. & Phinney, Leslie Mary
Partner: UNT Libraries Government Documents Department

The Sandia MEMS Passive Shock Sensor : FY08 testing for functionality, model validation, and technology readiness.

Description: This report summarizes the functional, model validation, and technology readiness testing of the Sandia MEMS Passive Shock Sensor in FY08. Functional testing of a large number of revision 4 parts showed robust and consistent performance. Model validation testing helped tune the models to match data well and identified several areas for future investigation related to high frequency sensitivity and thermal effects. Finally, technology readiness testing demonstrated the integrated elements of the sensor under realistic environments.
Date: October 1, 2008
Creator: Walraven, Jeremy Allen; Blecke, Jill; Baker, Michael Sean; Clemens, Rebecca C.; Mitchell, John Anthony; Brake, Matthew Robert et al.
Partner: UNT Libraries Government Documents Department

The Sandia MEMS passive shock sensor : FY08 design summary.

Description: This report summarizes design and modeling activities for the MEMS passive shock sensor. It provides a description of past design revisions, including the purposes and major differences between design revisions but with a focus on Revisions 4 through 7 and the work performed in fiscal year 2008 (FY08). This report is a reference for comparing different designs; it summarizes design parameters and analysis results, and identifies test structures. It also highlights some of the changes and or additions to models previously documented [Mitchell et al. 2006, Mitchell et al. 2008] such as the way uncertainty thresholds are analyzed and reported. It also includes dynamic simulation results used to investigate how positioning of hard stops may reduce vibration sensitivity.
Date: November 1, 2008
Creator: Walraven, Jeremy Allen; Baker, Michael Sean; Clemens, Rebecca C.; Mitchell, John Anthony; Brake, Matthew Robert; Epp, David S. et al.
Partner: UNT Libraries Government Documents Department

Development of a novel technique to assess the vulnerability of micro-mechanical system components to environmentally assisted cracking.

Description: Microelectromechanical systems (MEMS) will play an important functional role in future DOE weapon and Homeland Security applications. If these emerging technologies are to be applied successfully, it is imperative that the long-term degradation of the materials of construction be understood. Unlike electrical devices, MEMS devices have a mechanical aspect to their function. Some components (e.g., springs) will be subjected to stresses beyond whatever residual stresses exist from fabrication. These stresses, combined with possible abnormal exposure environments (e.g., humidity, contamination), introduce a vulnerability to environmentally assisted cracking (EAC). EAC is manifested as the nucleation and propagation of a stable crack at mechanical loads/stresses far below what would be expected based solely upon the materials mechanical properties. If not addressed, EAC can lead to sudden, catastrophic failure. Considering the materials of construction and the very small feature size, EAC represents a high-risk environmentally induced degradation mode for MEMS devices. Currently, the lack of applicable characterization techniques is preventing the needed vulnerability assessment. The objective of this work is to address this deficiency by developing techniques to detect and quantify EAC in MEMS materials and structures. Such techniques will allow real-time detection of crack initiation and propagation. The information gained will establish the appropriate combinations of environment (defining packaging requirements), local stress levels, and metallurgical factors (composition, grain size and orientation) that must be achieved to prevent EAC.
Date: November 1, 2006
Creator: Enos, David George & Goods, Steven Howard
Partner: UNT Libraries Government Documents Department

Final report : compliant thermo-mechanical MEMS actuators, LDRD #52553.

Description: Thermal actuators have proven to be a robust actuation method in surface-micromachined MEMS processes. Their higher output force and lower input voltage make them an attractive alternative to more traditional electrostatic actuation methods. A predictive model of thermal actuator behavior has been developed and validated that can be used as a design tool to customize the performance of an actuator to a specific application. This tool has also been used to better understand thermal actuator reliability by comparing the maximum actuator temperature to the measured lifetime. Modeling thermal actuator behavior requires the use of two sequentially coupled models, the first to predict the temperature increase of the actuator due to the applied current and the second to model the mechanical response of the structure due to the increase in temperature. These two models have been developed using Matlab for the thermal response and ANSYS for the structural response. Both models have been shown to agree well with experimental data. In a parallel effort, the reliability and failure mechanisms of thermal actuators have been studied. Their response to electrical overstress and electrostatic discharge has been measured and a study has been performed to determine actuator lifetime at various temperatures and operating conditions. The results from this study have been used to determine a maximum reliable operating temperature that, when used in conjunction with the predictive model, enables us to design in reliability and customize the performance of an actuator at the design stage.
Date: December 1, 2004
Creator: Walraven, Jeremy Allen; Baker, Michael Sean; Headley, Thomas Jeffrey & Plass, Richard Anton
Partner: UNT Libraries Government Documents Department

Multiscale thermal transport.

Description: A concurrent computational and experimental investigation of thermal transport is performed with the goal of improving understanding of, and predictive capability for, thermal transport in microdevices. The computational component involves Monte Carlo simulation of phonon transport. In these simulations, all acoustic modes are included and their properties are drawn from a realistic dispersion relation. Phonon-phonon and phonon-boundary scattering events are treated independently. A new set of phonon-phonon scattering coefficients are proposed that reflect the elimination of assumptions present in earlier analytical work from the simulation. The experimental component involves steady-state measurement of thermal conductivity on silicon films as thin as 340nm at a range of temperatures. Agreement between the experiment and simulation on single-crystal silicon thin films is excellent, Agreement for polycrystalline films is promising, but significant work remains to be done before predictions can be made confidently. Knowledge gained from these efforts was used to construct improved semiclassical models with the goal of representing microscale effects in existing macroscale codes in a computationally efficient manner.
Date: February 1, 2004
Creator: Graham, Samuel, Jr.; Wong, C. C. & Piekos, Edward Stanley
Partner: UNT Libraries Government Documents Department

Development of Characterization Tools for Reliability Testing of MicroElectroMechanical System Actuators

Description: Characterization tools have been developed to study the performance characteristics and reliability of surface micromachined actuators. These tools include (1) the ability to electrically stimulate or stress the actuator, (2) the capability to visually inspect the devices in operation, (3) a method for capturing operational information, and (4) a method to extract performance characteristics from the operational information. Additionally, a novel test structure has been developed to measure electrostatic forces developed by a comb drive actuator.
Date: July 26, 1999
Creator: Allen, James J.; Eaton, William P.; Smith, Norman F. & Tanner, Danelle M.
Partner: UNT Libraries Government Documents Department

Defect-related internal dissipation in mechanical resonators and the study of coupled mechanical systems.

Description: Understanding internal dissipation in resonant mechanical systems at the micro- and nanoscale is of great technological and fundamental interest. Resonant mechanical systems are central to many sensor technologies, and microscale resonators form the basis of a variety of scanning probe microscopies. Furthermore, coupled resonant mechanical systems are of great utility for the study of complex dynamics in systems ranging from biology to electronics to photonics. In this work, we report the detailed experimental study of internal dissipation in micro- and nanomechanical oscillators fabricated from amorphous and crystalline diamond materials, atomistic modeling of dissipation in amorphous, defect-free, and defect-containing crystalline silicon, and experimental work on the properties of one-dimensional and two-dimensional coupled mechanical oscillator arrays. We have identified that internal dissipation in most micro- and nanoscale oscillators is limited by defect relaxation processes, with large differences in the nature of the defects as the local order of the material ranges from amorphous to crystalline. Atomistic simulations also showed a dominant role of defect relaxation processes in controlling internal dissipation. Our studies of one-dimensional and two-dimensional coupled oscillator arrays revealed that it is possible to create mechanical systems that should be ideal for the study of non-linear dynamics and localization.
Date: January 1, 2007
Creator: Friedmann, Thomas Aquinas; Czaplewski, David A.; Sullivan, John Patrick; Modine, Normand Arthur; Wendt, Joel Robert; Aslam, Dean (Michigan State University, Lansing, MI) et al.
Partner: UNT Libraries Government Documents Department

The Sandia MEMS passive shock sensor : FY07 maturation activities.

Description: This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.
Date: August 1, 2008
Creator: Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C. et al.
Partner: UNT Libraries Government Documents Department

Predicting fracture in micron-scale polycrystalline silicon MEMS structures.

Description: Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures in a brittle manner with considerable variability in measured strength. Furthermore, it is not clear how to use a measured tensile strength distribution to predict the strength of a complex MEMS structure. To address such issues, two recently developed high throughput MEMS tensile test techniques have been used to measure strength distribution tails. The measured tensile strength distributions enable the definition of a threshold strength as well as an inferred maximum flaw size. The nature of strength-controlling flaws has been identified and sources of the observed variation in strength investigated. A double edge-notched specimen geometry was also tested to study the effect of a severe, micron-scale stress concentration on the measured strength distribution. Strength-based, Weibull-based, and fracture mechanics-based failure analyses were performed and compared with the experimental results.
Date: September 1, 2010
Creator: Hazra, Siddharth S. (Carnegie Mellon University, Pittsburgh, PA); de Boer, Maarten Pieter (Carnegie Mellon University, Pittsburgh, PA); Boyce, Brad Lee; Ohlhausen, James Anthony; Foulk, James W., III & Reedy, Earl David, Jr.
Partner: UNT Libraries Government Documents Department

A few nascent methods for measuring mechanical properties of the biological cell.

Description: This report summarizes a survey of several new methods for obtaining mechanical and rheological properties of single biological cells, in particular: (1) The use of laser Doppler vibrometry (LDV) to measure the natural vibrations of certain cells. (2) The development of a novel micro-electro-mechanical system (MEMS) for obtaining high-resolution force-displacement curves. (3) The use of the atomic force microscope (AFM) for cell imaging. (4) The adaptation of a novel squeezing-flow technique to micro-scale measurement. The LDV technique was used to investigate the recent finding reported by others that the membranes of certain biological cells vibrate naturally, and that the vibration can be detected clearly with recent instrumentation. The LDV has been reported to detect motions of certain biological cells indirectly through the motion of a probe. In this project, trials on Saccharomyces cerevisiae tested and rejected the hypothesis that the LDV could measure vibrations of the cell membranes directly. The MEMS investigated in the second technique is a polysilicon surface-micromachined force sensor that is able to measure forces to a few pN in both air and water. The simple device consists of compliant springs with force constants as low as 0.3 milliN/m and Moire patterns for nanometer-scale optical displacement measurement. Fields from an electromagnet created forces on magnetic micro beads glued to the force sensors. These forces were measured and agreed well with finite element prediction. It was demonstrated that the force sensor was fully functional when immersed in aqueous buffer. These results show the force sensors can be useful for calibrating magnetic forces on magnetic beads and also for direct measurement of biophysical forces on-chip. The use of atomic force microscopy (AFM) for profiling the geometry of red blood cells was the third technique investigated here. An important finding was that the method commonly used for attaching the cells ...
Date: January 1, 2006
Creator: Thayer, Gayle Echo; de Boer, Maarten Pieter; Corvalan, Carlos (Purdue University, West Lafayette, IN); Corwin, Alex David; Campanella, Osvaldo H. (Purdue University, West Lafayette, IN); Nivens, David (Purdue University, West Lafayette, IN) et al.
Partner: UNT Libraries Government Documents Department

Integrated superhard and metallic coatings for MEMS : LDRD 57300 final report.

Description: Two major research areas pertinent to microelectromechanical systems (MEMS) materials and material surfaces were explored and developed in this 5-year PECASE LDRD project carried out by Professor Roya Maboudian and her collaborators at the University of California at Berkeley. In the first research area, polycrystalline silicon carbide (poly-SiC) was developed as a structural material for MEMS. This material is potentially interesting for MEMS because compared to polycrystalline silicon (polysilicon), the structural material in Sandia National Laboratories' SUMMiTV process, it may exhibit high wear resistance, high temperature operation and a high Young's modulus to density ratio. Each of these characteristics may extend the usefulness of MEMS in Sandia National Laboratories' applications. For example, using polycrystalline silicon, wear is an important issue in microengines, temperature degradation is of concern in thermal actuators and the characteristics of resonators can be extended with the same lithography technology. Two methods of depositing poly-SiC from a 1,3-disilabutane source at 650 C to 800 C by low-pressure chemical vapor deposition (LPCVD) were demonstrated. These include a blanket method in which the material is made entirely out of poly-SiC and a method to coat previously released and fabricated polysilicon MEMS. This deposition method is much simpler to use than previous methods such as high temperature LPCVD and atmospheric CVD. Other major processing issues that were surmounted in this LDRD with the poly-SiC film include etching, doping, and residual strain control. SiC is inert and as such is notoriously difficult to etch. Here, an HBr-based chemistry was demonstrated for the first time to make highly selective etching of SiC at high etch rates. Nitrogen was incorporated from an NH3 gas source, resulting in high conductivity films. Residual strain and strain gradient were shown to depend on deposition parameters, and can be made negative or positive. The tribology of poly-SiC ...
Date: December 1, 2004
Creator: de Boer, Maarten Pieter & Maboudian, Roya (University of California at Berkeley, Berkeley, CA.)
Partner: UNT Libraries Government Documents Department

Integration of optoelectronics and MEMS by free-space micro-optics

Description: This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shattering of optical sources. The two technologies use dissimilar materials with significant compatibility problems for a common process line. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and through-vias in the substrate. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light. The authors explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. The components can be surface-mounted by flip-chip bonding to the substrate. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate from one device to another and them be directed out of the substrate into free space. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. They report progress on a MEMS-based laser scanner using these concepts.
Date: June 1, 2000
Creator: WARREN,MIAL E.; SPAHN,OLGA B.; SWEATT,WILLIAM C.; SHUL,RANDY J.; WENDT,JOEL R.; VAWTER,GREGORY A. et al.
Partner: UNT Libraries Government Documents Department

Characterization of a new class of surface micromachined pumps.

Description: This is the latest in a series of LDRD's that we have been conducting with Florida State University/Florida A&M University (FSU/FAMU) under the campus executive program. This research builds on the earlier projects; ''Development of Highly Integrated Magnetically and Electrostatically Actuated Micropumps'' (SAND2003-4674) and ''Development of Magnetically and Electrostatically Driven Surface Micromachined Pumps'' (SAND2002-0704P). In this year's LDRD we designed 2nd generation of surface micromachined (SMM) gear and viscous pumps. Two SUMMiT{trademark} modules full of design variations of these pumps were fabricated and one SwIFT{trademark} module is still in fabrication. The SwIFT{trademark} fabrication process results in a transparent pump housing cover that will enable visualization inside the pumps. Since the SwIFT{trademark} pumps have not been tested as they are still in fabrication, this report will focus on the 2nd generation SUMMiT{trademark} designs. Pump testing (pressure vs. flow) was conducted on several of the SUMMiT{trademark} designs resulting in the first pump curve for this class of SMM pumps. A pump curve was generated for the higher torque 2nd generation gear pump designed by Jason Hendrix of FSU. The pump maximum flow rate at zero head was 6.5 nl/s for a 30V, 30 Hz square wave signal. This level of flow rate would be more than adequate for our typical SMM SUMMiT{trademark} or SwIFT{trademark} channels which have typical volumes on the order of 50 pl.
Date: December 1, 2004
Creator: Galambos, Paul C.
Partner: UNT Libraries Government Documents Department

Integrated optical MEMS using through-wafer vias and bump-bonding.

Description: This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.
Date: January 1, 2008
Creator: McCormick, Frederick Bossert & Frederick, Scott K.
Partner: UNT Libraries Government Documents Department

A digital accelerometer array utilizing suprathreshold stochastic resonance for detection of sub-Brownian noise floor accelerations.

Description: The goal of this LDRD project was to evaluate the possibilities of utilizing Stochastic resonance in micromechanical sensor systems as a means for increasing signal to noise for physical sensors. A careful study of this field reveals that in the case of a single sensing element, stochastic resonance offers no real advantage. We have, however, identified a system that can utilize very similar concepts to stochastic resonance in order to achieve an arrayed sensor system that could be superior to existing technologies in the field of inertial sensors, and could offer a very low power technique for achieving navigation grade inertial measurement units.
Date: December 1, 2004
Creator: Carr, Dustin Wade & Olsson, Roy H.
Partner: UNT Libraries Government Documents Department

SummitView 1.0: a code to automatically generate 3D solid models of surface micro-machining based MEMS designs.

Description: This report describes the SummitView 1.0 computer code developed at Sandia National Laboratories. SummitView is designed to generate a 3D solid model, amenable to visualization and meshing, that represents the end state of a microsystem fabrication process such as the SUMMiT (Sandia Ultra-Planar Multilevel MEMS Technology) V process. Functionally, SummitView performs essentially the same computational task as an earlier code called the 3D Geometry modeler [1]. However, because SummitView is based on 2D instead of 3D data structures and operations, it has significant speed and robustness advantages. As input it requires a definition of both the process itself and the collection of individual 2D masks created by the designer and associated with each of the process steps. The definition of the process is contained in a special process definition file [2] and the 2D masks are contained in MEM format files [3]. The code is written in C++ and consists of a set of classes and routines. The classes represent the geometric data and the SUMMiT V process steps. Classes are provided for the following process steps: Planar Deposition, Planar Etch, Conformal Deposition, Dry Etch, Wet Etch and Release Etch. SummitView is built upon the 2D Boolean library GBL-2D [4], and thus contains all of that library's functionality.
Date: November 1, 2006
Creator: McBride, Cory L. (Elemental Technologies, American Fort, UT); Yarberry, Victor R.; Schmidt, Rodney Cannon & Meyers, Ray J. (Elemental Technologies, American Fort, UT)
Partner: UNT Libraries Government Documents Department

Si-based RF MEMS components.

Description: Radio frequency microelectromechanical systems (RF MEMS) are an enabling technology for next-generation communications and radar systems in both military and commercial sectors. RF MEMS-based reconfigurable circuits outperform solid-state circuits in terms of insertion loss, linearity, and static power consumption and are advantageous in applications where high signal power and nanosecond switching speeds are not required. We have demonstrated a number of RF MEMS switches on high-resistivity silicon (high-R Si) that were fabricated by leveraging the volume manufacturing processes available in the Microelectronics Development Laboratory (MDL), a Class-1, radiation-hardened CMOS manufacturing facility. We describe novel tungsten and aluminum-based processes, and present results of switches developed in each of these processes. Series and shunt ohmic switches and shunt capacitive switches were successfully demonstrated. The implications of fabricating on high-R Si and suggested future directions for developing low-loss RF MEMS-based circuits are also discussed.
Date: January 1, 2005
Creator: Stevens, James E.; Nordquist, Christopher Daniel; Baker, Michael Sean; Fleming, James Grant; Stewart, Harold D. & Dyck, Christopher William
Partner: UNT Libraries Government Documents Department

Solution-verified reliability analysis and design of bistable MEMS using error estimation and adaptivity.

Description: This report documents the results for an FY06 ASC Algorithms Level 2 milestone combining error estimation and adaptivity, uncertainty quantification, and probabilistic design capabilities applied to the analysis and design of bistable MEMS. Through the use of error estimation and adaptive mesh refinement, solution verification can be performed in an automated and parameter-adaptive manner. The resulting uncertainty analysis and probabilistic design studies are shown to be more accurate, efficient, reliable, and convenient.
Date: October 1, 2006
Creator: Eldred, Michael Scott; Subia, Samuel Ramirez; Neckels, David; Hopkins, Matthew Morgan; Notz, Patrick K.; Adams, Brian M. et al.
Partner: UNT Libraries Government Documents Department