Mechanical Behavior of Grain Boundary Engineered Copper
Description:
A grain boundary engineered copper sample previously characterized by Electron Backscatter Diffraction (EBSD) has been selected for nanoindentation tests. Given the fact that grain boundaries have thicknesses in the order of 1 micron or less, it is essential to use nanomechanics to test the properties of individual grain boundaries. The Hysitron nanoindenter was selected over the MTS nanoindenter due to its superior optical capabilities that aid the selection and identification of the areas to …
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Date:
August 8, 2006
Creator:
Carter, S B & Hodge, A M
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Partner:
UNT Libraries Government Documents Department