Studies on the disbonding initiation of interfacial cracks.
Description:
With the continuing trend of decreasing feature sizes in flip-chip assemblies, the reliability tolerance to interfacial flaws is also decreasing. Small-scale disbonds will become more of a concern, pointing to the need for a better understanding of the initiation stage of interfacial delamination. With most accepted adhesion metric methodologies tailored to predict failure under the prior existence of a disbond, the study of the initiation phenomenon is open to development and standardization o…
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Date:
August 1, 2005
Creator:
McAdams, Brian J. (Lehigh University, Bethlehem, PA) & Pearson, Raymond A. (Lehigh University, Bethlehem, PA)
Item Type:
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Partner:
UNT Libraries Government Documents Department