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Effect of Precipitate Particles on Creep of Aluminum-Copper Alloys During Age Hardening

Description: Note presenting an investigation of spherical or platelike precipitates prepared in aluminum alloys with 1 to 4 weight percent copper. The effects of controlled sizes and distributions of particles were determined by creep, tensile, and hardness measurements by quantitative metallographic evaluation of the particle characteristics, and by X-ray and electron-microscope examinations.
Date: September 1958
Creator: Underwood, E. E.; Marsh, L. L. & Manning, G. K.
Partner: UNT Libraries Government Documents Department

Preliminary Investigation of Effects of Gamma Radiation on Age-Hardening Rate of an Aluminum-Copper Alloy

Description: "A preliminary investigation was made to determine the effects of gamma radiation on the age-hardening rate of an aluminum-copper alloy at temperatures of 32 and 70 degrees Fahrenheit. The gamma radiation from a 100-milligram radium source appeared to have no significant effect on the age-hardening rate of the alloy. A metallographic examination of the test specimens showed no microstructural changes that could be attributed to gamma radiation" (p. 1).
Date: June 20, 1947
Creator: Kittel, J. Howard
Partner: UNT Libraries Government Documents Department

Influence of Alloying upon Grain-Boundary Creep

Description: "Grain-boundary displacement, occurring in bicrystals during creep at elevated temperature (350 degrees c), has been measured as a function of the copper content (0.1 to 3 percent) in a series of aluminum-rich aluminum-copper solid-solution alloys. The minimums in stress and temperature, below which grain-boundary motion does not occur, increase regularly with the copper content as would be expected if recovery is necessary for movement. Otherwise, the effects, if any, of the copper solute upon grain-boundary displacement and its rate are too small for identification by the experimental technique employed" (p. 1).
Date: June 24, 1955
Creator: Rhines, F. N.; Bond, W. E. & Kissel, M. A.
Partner: UNT Libraries Government Documents Department

Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys

Description: The focus of this research is to study the interaction between copper and the diffusion barrier/adhesion promoter. The behavior of copper sputter-deposited onto sputter-cleaned tantalum nitride is investigated. The data show that copper growth on tantalum nitride proceeds with the formation of 3-D islands, indicating poor adhesion characteristics between copper and Ta0.4N. Post-annealing experiments indicate that copper will diffuse into Ta0.4N at 800 K. Although the data suggests that Ta0.4N is effective in preventing copper diffusion, copper's inability to wet Ta0.4N will render this barrier ineffective. The interaction of copper with oxidized tantalum silicon nitride (O/TaSiN) is characterized. The data indicate that initial copper depositions result in the formation a conformal ionic layer followed by Cu(0) formation in subsequent depositions. Post-deposition annealing experiments performed indicate that although diffusion does not occur for temperatures less than 800 K, copper "de-wetting" occurs for temperatures above 500 K. These results indicate that in conditions where the substrate has been oxidized facile de-wetting of copper may occur. The behavior of a sputter-deposited Cu0.6Al0.4 film with SiO2 (Cu0.6Al0.4/SiO2) is investigated. The data indicate that aluminum segregates to the SiO2 interface and becomes oxidized. For copper coverages less than ~ 0.31 ML (based on a Cu/O atomic ratio), only Cu(I) formation is observed. At higher coverages, Cu(0) is observed. These data are in contrast with the observed behavior of copper metal deposited onto SiO2 (Cu/SiO2). The data for Cu/SiO2 show that copper does not wet SiO2 and forms 3-D nuclei. Furthermore, post-annealing experiments performed on Cu0.6Al0.4/SiO2 show that neither de-wetting nor diffusion of copper occurs for temperatures up to 800 K, while Cu diffusion into SiO2 occurs ~ 600 K. These data indicate that aluminum alloyed with copper at the SiO2 interface serves as an effective adhesion promoter and thermal diffusion barrier.
Date: August 2000
Creator: Shepherd, Krupanand Solomon
Partner: UNT Libraries

Microstructure Development and Characteristics of Semisolid Aluminum Alloys

Description: A drop forge viscometer was employed to investigate the flow behavior under very rapid compression rates of A357, A356 diluted with pure aluminum and Al-4.5%Cu alloys. The A357 alloys were of commercial origin (MHD and SIMA) and the rheocast, modified A356 and Al-4.5Cu alloys were produced by a process developed at the solidification laboratory of MIT.
Date: May 15, 2001
Creator: Flemings, Merton & Viswanathan, srinath
Partner: UNT Libraries Government Documents Department

Development of lead-free copper alloy graphite castings. Annual report, January--December 1995

Description: The distribution of graphite particles in graphite containing copper alloy was further improved very significantly using several procedures and technological modifications. The developed techniques attacked the graphite distribution problem in two ways. Realizing that clustering of very fine (5um) graphite particles is one of the two major problems, a pretreatment process has been developed using aluminum powders to deagglomerate graphite particles. Along with this, a two-stage stirring technique was used to first incorporate and then to distribute uniformly the deagglomerated particles in the melt. During this year, based on these developments, several components were cast to evaluate the castability of Cu alloy-graphite melts. In addition, machinability tests were done to clearly established that addition of graphite particles improve the machinability of copper MMC alloys over and above that of monolithic copper alloys. The results show that the machining chip sizes and cutting forces of Cu alloys containing graphite particles are smaller than these of the corresponding monolithic Cu alloys. This clearly establishes that the presence of graphite particles in copper alloy improves the machinability in a fashion similar to lead additions to copper alloys. Centrifugal casting of shapes of different sizes appear to be a very attractive method for casting graphite containing copper alloys, since all the graphite particles (regardless of their distribution in the melt) are forced to segregate to the inner periphery of the castings where they impart a very desirable solid lubrication property for bushing and bearing use. A very large number of cylindrical elements of lead bearing copper alloys are now used for similar bearing bushing applications and the manufacturers of these type of bearings are under safety and health hazard pressure to remove lead. This year several parameters for centrifugal casting of copper graphite alloys have been established.
Date: October 1, 1996
Creator: Rohatgi, P.K.
Partner: UNT Libraries Government Documents Department

A viscoplastic theory for braze alloys

Description: A new viscoplastic theory for CusilABA and other braze alloys has been developed. Like previous viscoplastic theories,this new theory uses a hyperbolic sine function of effective stress in its kinetic equation for the inelastic strain rate. This new theory has an internal state variable which accounts for isotropic hardening and recovery and a second-order, internal state tensor which accounts for kinematic hardening and recovery. Unlike previous theories, the new theory uses evolution equations for the state variables which describe competing mechanisms of power law hardening and static recovery. The evolution equations used in previous theories describe competing mechanisms of linear hardening, dynamic and static recovery. The new viscoplastic theory was implemented in several finite element codes and used in several metal-to-ceramic brazing simulations. Two approaches for obtaining material parameters for the new viscoplastic theory were developed.
Date: April 1, 1996
Creator: Neilsen, M.K.; Burchett, S.N.; Stone, C.M. & Stephens, J.J.
Partner: UNT Libraries Government Documents Department

Thermomechanical processing of tungsten-copper composites

Description: A tungsten-40 wt% Cu composite was consolidated by liquid-phase sintering and further processed to full density by a number of deformation methods. Fully dense materials were obtained by hot extrusion or cold rolling of the W-Cu composite. Subsequent processing by cold rolling, cold swaging, or hot swaging did not produce large changes in the aspect ratio of the W particles. The materials develop high hardness with small grain sizes of 5 {mu}m or less. The work-hardening, recrystallization, and grain growth of the material are characterized, and the hardness and tensile properties are related to processing parameters. Wire with tensile strengths up to 1120 MPa were produced. Further improvements in properties are anticipated with optimized processing parameters.
Date: May 1, 1996
Creator: Ohriner, E.K. & Bryskin, B.
Partner: UNT Libraries Government Documents Department

Rapid tooling by electron-beam vapor deposition

Description: Electron-beam physical vapor deposition (EBPVD) of tooling metal, onto a shaped substrate to produce a replica of the substrate surface, offers the potential for significant cost savings over present methods of injection mold manufacturing. These savings are realized by the high deposition rate and the corresponding short manufacturing times provided by the EBPVD process. However, on route to realizing these gains, there are process technical issues which need to be resolved. Mold surfaces typically contain relatively high aspect ratio details that must be replicated to dimensional tolerances within +/- 2 mils. The deposited mold material must also provide high surface hardness and high fracture toughness. Good quality grain structure can be obtained in deposited Al 10-wt% Cu mold material when the substrate and corresponding deposit are at high process temperature. However, the resulting mold is subject to distortion during cooldown due to differential temperatures and shrinkage rates. Thermally controlled cooldown and the use of crushable substrate materials reduce these distortions, but not to the required levels of tolerance. Deposition of the Al-Cu at lower temperature produces columnar, poorly joined grains which result in a brittle and weakened mold material. When Al 10-wt% Cu metal vapor is deposited across high aspect ratio step features on the substrate surface, a grain growth defect can form in the step-shadowed regions of the deposited material, alongside the step feature. The step coverage defect consists of entrained voids which persist at intermediate deposition temperatures and produce a weakened mold. This final 1997 LDRD report investigates causes of this step coverage defect and offers methods for their control and elimination.
Date: February 25, 1998
Creator: Meier, T. C., LLNL
Partner: UNT Libraries Government Documents Department

Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system

Description: A model describing diffusion-controlled growth of multiple intermetallic layers and the displacement of the interfaces between layers was developed and implemented in a 1-D computer code based on method-of-lines. The code was applied to analysis of intermetallic layer growth in isothermal solder aging experiments performed with 100 Sn/Cu and 63Sn-37Pb/Cu solder-substrate systems. Analyses indicated that intermetallic layer growth was consistent with a bulk diffusion mechanism involving Cu and/or Sn. In this work, nonisothermal solder-aging experiments were done with the 63Sn- 37Pb/Cu system using two temperature histories (4 cycles/day between 223-443 K, and 72 cycles/day between 223-443 K). Isothermal experiments were also done at 443 K. Thickness of Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} intermetallic layers were determined vs time for each temperature history. An updated version of the model and code were used to predict the intermetallic layer growth. Arrhenius expressions for diffusion coefficients in both Cu3Sn and Cu6Sn5 layers were determined. Agreement between prediction and experiment was generally good. In some cases, predicted layer growth was less than experiment, but within error. This paper describes the nonisothermal experiments and a comparison of predicted and observed layer growth vs time.
Date: December 31, 1996
Creator: Vianco, P.T.; Hopkins, P.L.; Erickson, K.L.; Frear, D.R. & Davidson, R.
Partner: UNT Libraries Government Documents Department

Growth and Oxidation of Thin Film Al(2)Cu

Description: Al{sub 2}Cu thin films ({approx} 382 nm) are fabricated by melting and resolidifying Al/Cu bilayers in the presence of a {micro} 3 nm Al{sub 2}O{sub 3} passivating layer. X-ray Photoelectron Spectroscopy (XPS) measures a 1.0 eV shift of the Cu2p{sub 3/2} peak and a 1.6 eV shift of the valence band relative to metallic Cu upon Al{sub 2}Cu formation. Scanning Electron microscopy (SEM) and Electron Back-Scattered Diffraction (EBSD) show that the Al{sub 2}Cu film is composed of 30-70 {micro}m wide and 10-25 mm long cellular grains with (110) orientation. The atomic composition of the film as estimated by Energy Dispersive Spectroscopy (EDS) is 67 {+-} 2% Al and 33 {+-} 2% Cu. XPS scans of Al{sub 2}O{sub 3}/Al{sub 2}Cu taken before and after air exposure indicate that the upper Al{sub 2}Cu layers undergo further oxidation to Al{sub 2}O{sub 3} even in the presence of {approx} 5 nm Al{sub 2}O{sub 3}. The majority of Cu produced from oxidation is believed to migrate below the Al{sub 2}O{sub 3} layers, based upon the lack of evidence for metallic Cu in the XPS scans. In contrast to Al/Cu passivated with Al{sub 2}O{sub 3}, melting/resolidifying the Al/Cu bilayer without Al{sub 2}O{sub 3} results in phase-segregated dendritic film growth.
Date: January 18, 2000
Creator: SON,KYUNG-AH; MISSERT,NANCY A.; BARBOUR,J. CHARLES; HREN,J.J.; COPELAND,ROBERT GUILD & MINOR,KENNETH G.
Partner: UNT Libraries Government Documents Department

Pressure dependence of defect emissions and the appearance of pressure-induced deep centers in chalcopyrite alloys AgxCu1-xGaS2

Description: We present the pressure dependence of the defect emissions in the chalcopyrite alloy semiconductor Ag{sub x}Cu{sub 1-x}GaS{sub 2} for values of the alloy concentration x varying between 0 and 1. A large variation in the pressure coefficients of the different defect emissions with x was found. In one alloy concentration x=0.25 deep levels were found to appear under pressure. Plausible explanations of our results have been proposed.
Date: December 31, 2000
Creator: Choi, In-Hwan & Yu, Peter Y.
Partner: UNT Libraries Government Documents Department