Influence of design and coatings on the mechanical reliability of semiconductor wafers.
Description:
We investigate some of the mechanical design factors of wafers and the effect on strength. Thin, solid, pre-stressed films are proposed as a means to improve the bulk mechanical properties of a wafer. Three-point bending was used to evaluate the laser scribe density and chemical processing effect on wafer strength. Drop and strike tests were employed to investigate the edge bevel profile effect on the mechanical properties of the wafer. To characterize the effect of thin films on stren…
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Date:
August 2002
Creator:
Yoder, Karl J.
Partner:
UNT Libraries