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Reduced-Temperature Transient-Liquid-Phase Bonding of AluminaUsing a Ag-Cu-Based Brazing Alloy

Description: The mechanical properties and microstructural evolution ofmetal-ceramic bonds produced using a transient liquid phase (TLP) aredescribed. Alumina (Al2O3) was joined at 500 degrees C, 600 degrees C,and 700 degrees C using a multilayer In/Cusil-ABA (R) (commercialcopper-silver eutectic brazing alloy)/In interlayer. The introduction ofthin In cladding layers allows the system to bond at much lowertemperatures than those typically used for brazing with Cusil-ABA (R),thereby protecting temperature-sensitive components. After chemicalhomogenization, the interlayers retain an operating temperature rangesimilar to that of the brazed joints. TLP bonds made at 500 degrees C,600 degrees C, and 700 degrees C with holding times ranging from as lowas 1.5 h to 24 h had average fracture strengths above 220 MPa. Theeffects of bonding temperature and time on fracture strength aredescribed. Preliminary analysis of the interlayers shows that the Ag-Inor Cu-In intermetallic phases do not form. Considerations unique tosystems with two-phase core layers are discussed. Experiments usingsingle-crystal sapphire indicate rapid formation of a reaction layer at700 degrees C, suggesting the possibility of making strong bonds usinglower temperatures and/or shorter processing times.
Date: December 19, 2005
Creator: Hong, Sung Moo & Glaeser, Andreas M.
Item Type: Refine your search to only Article
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