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Development of a high density pixel multichip module at Fermilab

Description: At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.
Date: September 11, 2001
Creator: al., Sergio Zimmermann et
Partner: UNT Libraries Government Documents Department

Development of high data readout rate pixel module and detector hybridization at Fermilab

Description: This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.
Date: March 20, 2001
Creator: al., Sergio Zimmermann et
Partner: UNT Libraries Government Documents Department