Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint
Description:
Encapsulant materials are used in a variety of applications to isolate components, areas, or other materials from potentially stressful conditions that can adversely affect the performance of a device.
Date:
August 1, 2008
Creator:
Kempe, M. D. & Thapa, P.
Item Type:
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Partner:
UNT Libraries Government Documents Department