Heat Pipe Integrated Microsystems
Description:
The trend in commercial electronics packaging to deliver ever smaller component packaging has enabled the development of new highly integrated modules meeting the demands of the next generation nano satellites. At under ten kilograms, these nano satellites will require both a greater density electronics and a melding of satellite structure and function. Better techniques must be developed to remove the subsequent heat generated by the active components required to-meet future computing requirem…
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Date:
March 30, 1999
Creator:
Gass, K.; Robertson, P.J.; Shul, R. & Tigges, C.
Item Type:
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Partner:
UNT Libraries Government Documents Department