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A high-throughput contact-hole resolution metric for photoresists:Full-process sensitivity study

Description: The ability to accurately quantify the intrinsic resolution of chemically amplified photoresists is critical for the optimization of resists for extreme ultraviolet (EUV) Iithography. We have recently reported on two resolution metrics that have been shown to extract resolution numbers consistent with direct observation. In this paper we examine the previously reported contact-hole resolution metric and explore the sensitivity of the metric to potential error sources associated with the experimental side of the resolution extraction process. For EUV exposures at the SEMATECH Berkeley microfield exposure tool, we report a full-process error-bar in extracted resolution of 1.75 nm RMS and verify this result experimentally.
Date: January 22, 2008
Creator: Anderson, Christopher N. & Naulleau, Patrick P.
Partner: UNT Libraries Government Documents Department

Mask roughness induced LER: a rule of thumb -- paper

Description: Much work has already been done on how both the resist and line-edge roughness (LER) on the mask affect the final printed LER. What is poorly understood, however, is the extent to which system-level effects such as mask surface roughness, illumination conditions, and defocus couple to speckle at the image plane, and currently factor into LER limits. Here, we propose a 'rule-of-thumb' simplified solution that provides a fast and powerful method to obtain mask roughness induced LER. We present modeling data on an older generation mask with a roughness of 230 pm as well as the ultimate target roughness of 50 pm. Moreover, we consider feature sizes of 50 nm and 22 nm, and show that as a function of correlation length, the LER peaks at the condition that the correlation length is approximately equal to the resolution of the imaging optic.
Date: March 12, 2010
Creator: McClinton, Brittany & Naulleau, Patrick
Partner: UNT Libraries Government Documents Department

Sensitivity study of reliable, high-throughput resolution metricsfor photoresists

Description: The resolution of chemically amplified resists is becoming an increasing concern, especially for lithography in the extreme ultraviolet (EUV) regime. Large-scale screening and performance-based down-selection is currently underway to identify resist platforms that can support shrinking feature sizes. Resist screening efforts, however, are hampered by the absence of reliable resolution metrics that can objectively quantify resist resolution in a high-throughput fashion. Here we examine two high-throughput metrics for resist resolution determination. After summarizing their details and justifying their utility, we characterize the sensitivity of both metrics to two of the main experimental uncertainties associated with lithographic exposure tools, namely: limited focus control and limited knowledge of optical aberrations. For an implementation at EUV wavelengths, we report aberration and focus limited error bars in extracted resolution of {approx} 1.25 nm RMS for both metrics making them attractive candidates for future screening and down-selection efforts.
Date: July 30, 2007
Creator: Anderson, Christopher N. & Naulleau, Patrick P.
Partner: UNT Libraries Government Documents Department

Corner rounding in EUV photoresist: tuning through molecular weight, PAG size, and development time

Description: In this paper, the corner rounding bias of a commercially available extreme ultraviolet photoresist is monitored as molecular weight, photoacid generator (PAG) size, and development time are varied. These experiments show that PAG size influences corner biasing while molecular weight and development time do not. Large PAGs are shown to exhibit less corner biasing, and in some cases, lower corner rounding, than small PAGs. In addition, heavier resist polymers are shown to exhibit less corner rounding than lighter ones.
Date: December 31, 2009
Creator: Anderson, Christopher; Daggett, Joe & Naulleau, Patrick
Partner: UNT Libraries Government Documents Department

Iterative procedure for in-situ EUV optical testing with an incoherent source

Description: We propose an iterative method for in-situ optical testing under partially coherent illumination that relies on the rapid computation of aerial images. In this method a known pattern is imaged with the test optic at several planes through focus. A model is created that iterates through possible aberration maps until the through-focus series of aerial images matches the experimental result. The computation time of calculating the through-focus series is significantly reduced by a-SOCS, an adapted form of the Sum Of Coherent Systems (SOCS) decomposition. In this method, the Hopkins formulation is described by an operator S which maps the space of pupil aberrations to the space of aerial images. This operator is well approximated by a truncated sum of its spectral components.
Date: December 1, 2009
Creator: Miyawaka, Ryan; Naulleau, Patrick & Zakhor, Avideh
Partner: UNT Libraries Government Documents Department

Correlation method for the measure of mask-induced line-edge roughness in extreme ultraviolet lithography

Description: As critical dimensions for leading-edge semiconductor devices shrink, line-edge roughness (LER) requirements are pushing well into the single digit nanometer regime. At these scales many new sources of LER must be considered. In the case of extreme ultraviolet (EUV) lithography, modeling has shown the lithographic mask to be a source of significant concern. Here we present a correlation-based methodology for experimentally measuring the magnitude of mask contributors to printed LER. The method is applied to recent printing results from a 0.3 numerical aperture EUV microfield exposure tool. The measurements demonstrate that such effects are indeed present and of significant magnitude. The method is also used to explore the effects of illumination coherence and defocus and has been used to verify model-based predictions of mask-induced LER.
Date: May 25, 2009
Creator: Naulleau, Patrick
Partner: UNT Libraries Government Documents Department

Microfield exposure tool enables advances in EUV lithography development

Description: With demonstrated resist resolution of 20 nm half pitch, the SEMATECH Berkeley BUV microfield exposure tool continues to push crucial advances in the areas of BUY resists and masks. The ever progressing shrink in computer chip feature sizes has been fueled over the years by a continual reduction in the wavelength of light used to pattern the chips. Recently, this trend has been threatened by unavailability of lens materials suitable for wavelengths shorter than 193 nm. To circumvent this roadblock, a reflective technology utilizing a significantly shorter extreme ultraviolet (EUV) wavelength (13.5 nm) has been under development for the past decade. The dramatic wavelength shrink was required to compensate for optical design limitations intrinsic in mirror-based systems compared to refractive lens systems. With this significant reduction in wavelength comes a variety of new challenges including developing sources of adequate power, photoresists with suitable resolution, sensitivity, and line-edge roughness characteristics, as well as the fabrication of reflection masks with zero defects. While source development can proceed in the absence of available exposure tools, in order for progress to be made in the areas of resists and masks it is crucial to have access to advanced exposure tools with resolutions equal to or better than that expected from initial production tools. These advanced development tools, however, need not be full field tools. Also, implementing such tools at synchrotron facilities allows them to be developed independent of the availability of reliable stand-alone BUY sources. One such tool is the SEMATECH Berkeley microfield exposure tool (MET). The most unique attribute of the SEMA TECH Berkeley MET is its use of a custom-coherence illuminator made possible by its implementation on a synchrotron beamline. With only conventional illumination and conventional binary masks, the resolution limit of the 0.3-NA optic is approximately 25 nm, however, with EUV ...
Date: September 7, 2009
Creator: Naulleau, Patrick
Partner: UNT Libraries Government Documents Department

SEMATECH EUV resist benchmarking results

Description: Extreme Ultraviolet Lithography (EUVL) is one of the leading candidates for next generation lithography technology for the 32 nm HP and beyond. The availability of EUV resists is one of the most significant challenges facing its commercialization. To accelerate EUV resist development, SEMATECH provides access to two exposure tools: (1) The EUV Resist Test Center (RTC) at SEMATECH at the University at Albany, SUNY, NY; and (2) the SEMATECH microexposure tools (ALS-MET) at Lawrence Berkeley National Laboratory (LBNL).
Date: October 27, 2007
Creator: Ma, Andy; Park, Joo-On; Dean, Kim; Wurm, Stefan & Naulleau, Patrick
Partner: UNT Libraries Government Documents Department

Experimental and model-based study of the robustness of line-edgeroughness metric extraction in the presence of noise

Description: As critical dimensions shrink, line edge and width roughness (LER and LWR) become of increasing concern. Crucial to the goal of reducing LER is its accurate characterization. LER has traditionally been represented as a single rms value. More recently the use of power spectral density (PSD), height-height correlation (HHCF), and {sigma} versus length plots has been proposed in order to extract the additional spatial descriptors of correlation length and roughness exponent. Here we perform a modeling-based noise-sensitivity study on the extraction of spatial descriptors from line-edge data as well as an experimental study of the robustness of these various descriptors using a large dataset of recent extreme-ultraviolet exposure data. The results show that in the presence of noise and in the large dataset limit, the PSD method provides higher accuracy in the extraction of the roughness exponent, whereas the HHCF method provides higher accuracy for the correlation length. On the other hand, when considering precision, the HHCF method is superior for both metrics.
Date: June 1, 2007
Creator: Naulleau, Patrick P. & Cain, Jason P.
Partner: UNT Libraries Government Documents Department

Holographic optical elements for the extreme-ultravioletregime

Description: As the development of extreme ultraviolet (EUV) lithography progresses, interest grows in the extension of traditional optical components to the EUV regime. The strong absorption of EUV by most materials and its extremely short wavelength, however, makes it very difficult to implement many components that are commonplace in the longer wavelength regimes. One such component is the diffractive optical element used, for example, in illumination systems to efficiently generate modified pupil fills. Here we demonstrate the fabrication and characterization of EUV binary phase-only computer-generated holograms allowing arbitrary far-field diffraction patterns to be generated.
Date: August 14, 2006
Creator: Naulleau, Patrick P.; Salmassi, Farhad; Gullikson, Eric M. & Anderson, Erik H.
Partner: UNT Libraries Government Documents Department

Spin-on-glass coatings for the generation of super-polishedsubstrates for extreme ultraviolet optics

Description: Substrates intended for use as extreme ultraviolet (EUV) optics have extremely stringent requirements in terms of finish. These requirements can dramatically increase the cost and fabrication time, especially when non-conventional shapes, such as toroids, are required. Here we present a spin-on-glass resist process capable of generating super-polished parts from inexpensive substrates. The method has been used to render diamond-turned substrates compatible for use as EUV optics. Toroidal diamond-turned optics with starting rms roughness in the 3.3 to 3.7 nm range have been smoothed to the 0.4 to 0.6 nm range. EUV reflectometry characterization of these optics has demonstrated reflectivities of approximately 63%.
Date: January 1, 2005
Creator: Salmassi, Farhad; Naulleau, Patrick P. & Gullikson, Eric M.
Partner: UNT Libraries Government Documents Department

Assessing out-of-band flare effects at the wafer level for EUV lithography

Description: To accurately estimate the flare contribution from the out-of-band (OOB), the integration of a DUV source into the SEMATECH Berkeley 0.3-NA Micro-field Exposure tool is proposed, enabling precisely controlled exposures along with the EUV patterning of resists in vacuum. First measurements evaluating the impact of bandwidth selected exposures with a table-top set-up and subsequent EUV patterning show significant impact on line-edge roughness and process performance. We outline a simulation-based method for computing the effective flare from resist sensitive wavelengths as a function of mask pattern types and sizes. This simulation method is benchmarked against measured OOB flare measurements and the results obtained are in agreement.
Date: January 25, 2010
Creator: George, Simi; Naulleau, Patrick; Kemp, Charles; Denham, Paul & Rekawa, Senajith
Partner: UNT Libraries Government Documents Department

Mask roughness and its implications for LER at the 22- and 16-nm nodes

Description: Line-edge roughness (LER) remains the most significant challenge facing the development of extreme ultraviolet (EUV) resist. The mask, however, has been found to be a significant contributor to image-plane LER. This has long been expected based on modeling and has more recently been demonstrated experimentally. Problems arise from both mask-absorber LER as well as mask multilayer roughness leading to random phase variations in the reflected beam and consequently speckle. Understanding the implications this has on mask requirements for the 22-nm half pitch node and below is crucial. Modeling results indicate a replicated surface roughness (RSR) specification of 50 pm and a ruthenium capping layer roughness specification of 440 pm. Moreover, modeling indicates that it is crucial to achieve the current ITRS specifications for mask absorber LER which is significantly smaller than current capabilities.
Date: February 16, 2010
Creator: Naulleau, Patrick; George, Simi A. & McClinton, Brittany M.
Partner: UNT Libraries Government Documents Department

EUV mask surface cleaning effects on lithography process performance

Description: The reflective, multilayer based, mask architectures for extreme ultraviolet (EUV) lithography are highly susceptible to surface oxidation and contamination. As a result, EUV masks are expected to undergo cleaning processes in order to maintain the lifetimes necessary for high volume manufacturing. For this study, the impact of repetitive cleaning of EUV masks on imaging performance was evaluated. Two, high quality industry standard, EUV masks are used for this study with one of the masks undergoing repeated cleaning and the other one kept as a reference. Lithographic performance, in terms of process window analysis and line edge roughness, was monitored after every two cleans and compared to the reference mask performance. After 8x clean, minimal degradation is observed. The cleaning cycles will be continued until significant loss imaging fidelity is found.
Date: June 18, 2010
Creator: George, Simi; Baclea-an, Lorie Mae; Naulleau, Patrick; Chen, Robert J. & Liang, Ted
Partner: UNT Libraries Government Documents Department

Deprotection blue in extreme ultraviolet photoresists: influence of base loading and post-exposure bake temperture

Description: The deprotection blur of Rohm and Haas XP 5435, XP 5271, and XP5496 extreme ultraviolet photoresists has been determined as their base weight percent is varied. They have also determined the deprotection blur of TOK EUVR P1123 photoresist as the post-exposure bake temperature is varied from 80 C to 120 C. In Rohm and Haas XP 5435 and XP5271 resists 7x and 3x (respective) increases in base weight percent reduce the size of successfully patterned 1:1 line-space features by 16 nm and 8 nm with corresponding reductions in deprotection blur of 7 nm and 4 nm. In XP 5496 a 7x increase in base weight percent reduces the size of successfully patterned 1:1 line-space features from 48 nm to 38 nm without changing deprotection blur. In TOK EUVR P1123 resist, a reduction in post-exposure bake temperature from 100 C to 80 C reduces deprotection blur from 21 nm to 10 nm and reduces patterned LER from 4.8 nm to 4.1 nm.
Date: June 2, 2008
Creator: Anderson, Christopher N. & Naulleau, Patrick P.
Partner: UNT Libraries Government Documents Department

Don't always blame the photons: Relationships between deprotection blur, LER, and shot noise in EUV photoresists

Description: A corner rounding metric has been used to determine the deprotection blur of Rohm and Haas XP 5435, XP 5271, and XP 5496 extreme ultraviolet (EUV) photoresists as base weight percent is varied; an experimental open platform photoresist (EH27) as base weight percent is varied; and TOK EUVR P1123 and FUJI 1195 photoresists as post-exposure bake (PEB) temperature is varied. In the XP 5435, XP 5271, XP 5496, and EH27 resist platforms, a 6 times increase in base weight percent reduces the size of successfully patterned 1:1 lines by over 10 nm and lowers intrinsic line-edge roughness (LER) by over 2.5 nm without changing deprotection blur. In TOK EUVR P1123 photoresist, lowering the PEB temperature from 100 C to 80 C reduces measured deprotection blur (using the corner metric) from 30 nm to 20 nm and reduces the LER of 50 nm 1:1 lines from 4.8 nm to 4.3 nm. These data are used to drive a lengthy discussion about the relationships between deprotection blur, LER, and shot noise in EUV photoresists. We provide two separate conclusions: (1) shot noise is probably not the dominant mechanism causing the 3-4 nm EUV LER floor that has been observed over the past several years; (2) chemical contrast contributes to LER whenever deprotection blur is large relative to the printed half pitch.
Date: June 2, 2008
Creator: Anderson, Christopher N. & Naulleau, Patrick P.
Partner: UNT Libraries Government Documents Department

Corner Rounding in Photoresists for Extreme Ultraviolet Lithography

Description: Deprotection blur in EUV resists fundamentally limits the smallest sized dense features that can be patterned in a single exposure and development step. Several metrics have recently been developed to explore the ways that different resist and process parameters affect the deprotection blur in EUV resists. One of these metrics is based on the imaging fidelity of a sharp corner on a large feature. As this metric has involved the close inspection of printing fidelity of corner features, it has brought attention to an interesting phenomena: corners print differently whether or not the remaining resist edge contains 270 degrees of resist or 90 degrees of resist. Here we present experimental data across a wide sampling of leading resists to show this effect is real and reproducible. They provide aerial image modeling results assuming thin and realistic mask models that show no corner bias between the aerial images in the 90-degree and 270-degree configurations. They also compare modeled patterning results assuming several resist models including the single blur, dual blur, and Prolith models, none of which reproduce the corner biasing that is observed experimentally.
Date: June 1, 2008
Creator: Anderson, Christopher N.; Naulleau, Patrick; Deng, Yunfei & Wallow, Thomas
Partner: UNT Libraries Government Documents Department

EUV micro-exposure tool at 0.5 NA for sub-16 nm lithography

Description: The resolution limit of present 0.3 NA 13.5 nm wavelength micro-exposure tools is compared to next generation lithography research requirements. Findings suggest that a successor design is needed for patterning starting at the 16 nm semiconductor process technology node. A two-mirror 0.5 NA optical design is presented, and performance expectations are established from detailed optical and lithographic simulation. Here, we report on the results from a SEMATECH program to fabricate a projection optic with an ultimate resolution limit of approximately 11 nm.
Date: September 26, 2008
Creator: Goldstein, Michael; Hudyma, Russ; Naulleau, Patrick & Wurm, Stefan
Partner: UNT Libraries Government Documents Department

EUV Resists: Illuminating the challenges

Description: As extreme ultraviolet (EUV) lithography enters the commercialization phase with potential introduction at the 3x nm half-pitch node in 2013, the attention of advanced EUV resist research has turned to addressing patterning at 16-nm half pitch and below. Whereas line-edge roughness is the primary concern at 2x half pitch and larger, research at the 16-nm half pitch level is uncovering broader.
Date: June 1, 2011
Creator: Naulleau, Patrick; Anderson, Christopher & George, Simi
Partner: UNT Libraries Government Documents Department

The effect of resist on the transfer of line-edge roughness spatial metrics from mask to wafer

Description: Mask contributors to line-edge roughness (LER) have recently been shown to be an issue of concern for both the accuracy of current resist evaluation tests as well the ultimate LER requirements for the 22-nm production node. More recently, it has been shown that the power spectral density of the mask-induced roughness, is markedly different than that of intrinsic resist roughness and thus potentially serves as a mechanism for distinguishing mask effects from resist effects in experimental results. Further considering stochastic resist effects, however, demonstrates that such a test would only be viable in cases where the resist effects are completely negligible in terms of their contribution to the total LER compared to the mask effects. The results presented here lead us to the surprising conclusion that it is indeed possible for mask contributors to be the dominant source of LER while the spatial characteristics of the LER remain indistinguishable from the fractal characteristics of resist-induced LER.
Date: May 1, 2009
Creator: Naulleau, Patrick & Gallatin, Gregg
Partner: UNT Libraries Government Documents Department

System-level line-edge roughness limits in extreme ultraviolet lithography

Description: As critical dimensions shrink, line edge and width roughness (LER and LWR) become of increasing concern. Traditionally LER is viewed as a resist-limited effect; however, as critical dimensions shrink and LER requirements become proportionally more stringent, system-level effects begin to play an important role. Recent advanced EUV resist testing results have demonstrated lower bounds on achievable LER at the level of approximately 2 to 3 nm. Here we use modeling to demonstrate that a significant portion of this low bound may in fact be do to system-level effects and in particular the mask. Of concern are both LER on the mask as well as roughness of the multilayer reflector. Modeling also shows roughness (flare) in the projection optics not to be of concern.
Date: February 13, 2008
Creator: Jones, Juanita; Naulleau, Patrick P; Niakoula, Dimitra & Zhang, Guojing
Partner: UNT Libraries Government Documents Department

Tilt sensitivity of the two-grating interferometer

Description: Fringe formation in the two-grating interferometer is analyzed in the presence of a small parallelism error between the diffraction gratings assumed in the direction of grating shear. Our analysis shows that with partially coherent illumination, fringe contrast in the interference plane is reduced in the presence of nonzero grating tilt with the effect proportional to the grating tilt angle and the grating spatial frequencies. Our analysis also shows that for a given angle between the gratings there is an angle between the final grating and the interference plane that optimizes fringe contrast across the field.
Date: January 30, 2008
Creator: Anderson, Christopher N. & Naulleau, Patrick P.
Partner: UNT Libraries Government Documents Department