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A new concept of vertically integrated pattern recognition associative memory

Description: Hardware-based pattern recognition for fast triggering on particle tracks has been successfully used in high-energy physics experiments for some time. The CDF Silicon Vertex Trigger (SVT) at the Fermilab Tevatron is an excellent example. The method used there, developed in the 1990's, is based on algorithms that use a massively parallel associative memory architecture to identify patterns efficiently at high speed. However, due to much higher occupancy and event rates at the LHC, and the fact that the LHC detectors have a much larger number of channels in their tracking detectors, there is an enormous challenge in implementing fast pattern recognition for a track trigger, requiring about three orders of magnitude more associative memory patterns than what was used in the original CDF SVT. Scaling of current technologies is unlikely to satisfy the scientific needs of the future, and investments in transformational new technologies need to be made. In this paper, we will discuss a new concept of using the emerging 3D vertical integration technology to significantly advance the state-of-the-art for fast pattern recognition within and outside HEP. A generic R and D proposal based on this new concept, with a few institutions involved, has recently been submitted to DOE with the goal to design and perform the ASIC engineering necessary to realize a prototype device. The progress of this R and D project will be reported in the future. Here we will only focus on the concept of this new approach.
Date: November 1, 2011
Creator: Liu, Ted; Hoff, Jim; Deptuch, Grzegorz; Yarema, Ray & /Fermilab
Partner: UNT Libraries Government Documents Department

Proposal for the development of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

Description: Future particle physics experiments looking for rare processes will have no choice but to address the demanding challenges of fast pattern recognition in triggering as detector hit density becomes significantly higher due to the high luminosity required to produce the rare process. The authors propose to develop a 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM) chip for HEP applications, to advance the state-of-the-art for pattern recognition and track reconstruction for fast triggering.
Date: October 1, 2010
Creator: Deptuch, Gregory; Hoff, Jim; Kwan, Simon; Lipton, Ron; Liu, Ted; Ramberg, Erik et al.
Partner: UNT Libraries Government Documents Department

3D design activities at Fermilab: Opportunities for physics

Description: Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
Date: January 1, 2009
Creator: Yarema, Raymond; Deptuch, Grezgorz; Hoff, Jim; Shenai, Alpana; Trimpl, Marcel; Zimmerman, Tom et al.
Partner: UNT Libraries Government Documents Department