An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.
Description:
The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided th…
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Date:
September 1, 2008
Creator:
Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank et al.
Item Type:
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Partner:
UNT Libraries Government Documents Department