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in creator/contributor: "Garino, T."

open access

Integration of thin film decoupling capacitors

Thin film decoupling capacitors consisting of submicron thick, sol-gel Pb(Zr,Ti)O{sub 3} layers between Pt electrodes on a Si substrate have recently been developed. Because the capacitor structure needs to be only {approximately}3 {mu}m thick, these devices offer advantages such as decreased package volume and ability to integrate so that interconnect inductance is decreased, which allows faster IC processing rates. To fully utilize these devices, techniques of integrating them onto packages s… more

Date: October 1, 1994

Creator: Garino, T.; Dimos, D. & Lockwood, S.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Fabrication of MEMS Devices by Powder-Filling into DXRL-Formed Molds

We have developed a variety of processes for fabricating components for micro devices based on deep x-ray lithography (DXRL). Although the techniques are applicable to many materials, we have demonstrated them using hard (Nd{sub 2}Fe{sub 14}B) and soft (Ni-Zn ferrite) magnetic materials because of the importance of these materials in magnetic micro-actuators and other devices and because of the difficulty fabricating them by other means. The simplest technique involves pressing a mixture of mag… more

Date: January 7, 1999

Creator: Christenson, T.; Garino, T.J. & Venturini, E.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Development and integration of applique decoupling capacitors

For high-speed integrated circuit applications, it is important to interconnect decoupling capacitors and integrated circuits (ICs) as intimately as possible, to minimize parasitic impedances. This can be achieved by mounting free-standing, thin film capacitors directly onto ICs as part of a chip-scale packaging approach. These applique capacitors utilize a chemically-prepared PLZT dielectric, which is nominally 1 {micro}m thick. The small size and weight of applique capacitors can be used to i… more

Date: October 1, 1996

Creator: Garino, T.J.; Dimos, D. & Lockwood, S.J.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Ceramic coatings on package lids for radiation protection

A study was conducted to determine the feasibility of coating gold plated kovar lids with colloidally bonded aluminum oxide. Radiation that is incident on a gold plated lid generates a large number of photoelectrons. These electrons can enhance the damage to microelectronic devices and circuits (ICs). The primary purpose of the coating is to stop the electrons emitted from the lid that would otherwise increase the damage to the IC. A coating system consisting of {approximately}95 wt % alumina (… more

Date: August 1, 1991

Creator: Garino, T.J.; Reber, C.A. & Fleetwood, D.M.

Item Type: Report

Partner: UNT Libraries Government Documents Department

open access

Deep X-Ray Lithography Based Fabrication of Rare-Earth Based Permanent Magnets and their Applications to Microactuators

Precision high aspect-ratio micro molds constructed by deep x-ray lithography have been used to batch fabricate accurately shaped bonded rare-earth based permanent magnets with features as small as 5 microns and thicknesses up to 500 microns. Maximum energy products of up to 8 MGOe have been achieved with a 20%/vol. epoxy bonded melt-spun isotropic Nd2Fe14b powder composite. Using individually processed sub- millimeter permanent sections multipole rotors have been assembled. Despite the fact th… more

Date: January 27, 1999

Creator: Christenson, T.R.; Garino, T.J. & Venturini, E.L.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Fabrication and Characterization of PZT Thin-Film on Bulk Micromachined Si Motion Detectors

Motion detectors consisting of Pb(Zr{sub x}Ti{sub (1{minus}x)})O{sub 3} (PZT) thin films, between platinum electrodes, on micromachined silicon compound clamped-clamped or cantilever beam structures were fabricated using either hot KOH or High Aspect Ratio Silicon Etching (HARSE) to micromachine the silicon. The beams were designed such that a thicker region served as a test mass that produced stress at the top of the membrane springs that supported it when the object to which the detector was … more

Date: January 7, 1999

Creator: Clem, P.; Garino, T. J.; Laguna, G. & Tuttle, B. A.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Direct-write fabrication of integrated, multilayer ceramic components

The need for advanced (electronic) ceramic components with smaller size, greater functionality, and enhanced reliability requires the ability to integrate electronic ceramics in complex 3-D architectures. For rapid prototyping and small-lot manufacturing, traditional tape casting and screen printing approaches are poorly suited. To address this need, the authors are developing a direct-write approach for fabricating highly integrated, multilayer components using a micropen to deposit slurries i… more

Date: August 1997

Creator: Dimos, D.; Yang, P.; Garino, T. J.; Raymond, M. V. & Rodriguez, M. A.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Characterization techniques to validate models of density variations in pressed powder compacts

Techniques for characterizing density gradients generated during typical powder compaction processes are reviewed and several are evaluated. The techniques reviewed are ultrasonic velocity measurements, laser ultrasonic velocity measurements, x-ray radiography, autoradiography, computer tomography (CT), magnetic resonance imaging (MRI), and simple image analysis of polished cross-sections. Experimental results are reported for all of these techniques except autoradiography, CT and MRI. The test… more

Date: July 1, 1995

Creator: Garino, T.; Mahoney, M.; Readey, M.; Ewsuk, K.; Gieske, J.; Stoker, G. et al.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Integrated decoupling capacitors using Pb(Zr,Ti)O{sub 3} thin films

Thin-film decoupling capacitors based on ferroelectric PLZT (PbLaZrTiO{sub 3}) films are being developed for advanced packaging. The increased integration that can be achieved by replacing surface- mount capacitors should lead to decreased package volume and improved high-speed performance. For this application, chemical solution deposition is an appropriate fabrication technique since it is a low- cost, high-throughput process. Relatively thick Pt electrodes (1{mu}m) are used to minimize serie… more

Date: July 1, 1996

Creator: Dimos, D.; Lockwood, S. J.; Garino, T. J.; Al-Shareef, H. N. & Schwartz, R. W.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Electrorheological fluids

An Electrorheological fluid is normally a low-viscosity colloidal suspension, but when an electric field is applied, the fluid undergoes a reversible transition to a solid, being able to support considerable stress without yield. Commercial possibilities for such fluids are enormous, including clutches, brakes, valves,shock absorbers, and stepper motors. However, performance of current fluids is inadequate for many proposed applications. Our goal was to engineer improved fluids by investigating… more

Date: October 1, 1996

Creator: Adolf, D.; Anderson, R.; Garino, T.; Halsey, T. C.; Hance, B.; Martin, J. E. et al.

Item Type: Report

Partner: UNT Libraries Government Documents Department

open access

Relationships between ferroelectric 90{degree} domain formation and electrical properties of chemically prepared Pb(Zr,Ti)O{sub 3} thin films

For PZT films deposited on Pt coated substrates, remanent polarization is a monotonic function of thermal expansion of the substrate, a result of 90{degree} domain formation occurring as the film is cooled through the transformation temperature. PZT film stress in the vicinity of the Curie point controls 90{degree} domain assemblages within the film. PZT films under tension at the transformation temperature area-domain oriented; whereas, films under compression at the transformation temperature… more

Date: July 1, 1994

Creator: Tuttle, B. A.; Garino, T. J. Voigt, J. A.; Headley, T. J.; Dimos, D. & Eatough, M. O.

Item Type: Article

Partner: UNT Libraries Government Documents Department

open access

Surface Micromachined Flexural Plate Wave Device Integrable on Silicon

Small, reliable chemical sensors are needed for a wide range of applications, such as weapon state-of-health monitoring, nonproliferation activities, and manufacturing emission monitoring. Significant improvements in present surface acoustic wave sensors could be achieved by developing a flexural plate-wave (FPW) architecture, in which acoustic waves are excited in a thin sensor membrane. Further enhancement of device performance could be realized by integrating a piezoelectric thin film on top… more

Date: January 1, 1999

Creator: Clem, P. G.; Dimos, D.; Garino, T. J.; Martin, S. J.; Mitchell, M. A.; Olson, W. R. et al.

Item Type: Report

Partner: UNT Libraries Government Documents Department

open access

Ferroelectric thin film microstructure development and related property enhancement

Factors that control phase evolution, microstructural development and ferroelectric domain assemblage are evaluated for chemically prepared lead zirconate titanate (PZT) thin films. Zirconium to titanium stoichiometry is shown to strongly influence microstructure. As Ti content increases, there is an apparent enhancement of the perovskite phase nucleation rate, grain size becomes smaller, and the amount of pyrochlore phase, if present, decreases. While the pyrochlore matrix microstructure for n… more

Date: November 1, 1993

Creator: Tuttle, B.; Voigt, J. A.; Headley, T. J.; Potter, B. G.; Dimos, D.; Schwartz, R. W. et al.

Item Type: Article

Partner: UNT Libraries Government Documents Department