Description: A doubly encapsulated thulia wafer, i.e., individually lined wafers stacked one upon another inside a fuel capsule was studied. The temperature profiles were determined for thulia power densities ranging from 8 to 24 W/cc and fuel capsule surface temperatures ranging from 1000/sup 0/F (538/sup 0/C) to 2000/sup 0/F (1093/sup 0/C). Parametric studies were also carried out on a singly encapsulated configuration in which the thulia wafers were stacked face to face in an infinitely long, lined cylinder. The doubly encapsulated wafer configuration yielded a lower centerline temperature than the singly encapsulated capsule. Only in extreme cases of a large wafer diameter in combination with a high thulia power density did the fuel capsule centerline temperature exceed the thulia melt temperature of 4172/sup 0/F (2300/sup 0/C). Results are also given for the maximum radius attainable without having centerline melting when using a thulia microsphere fuel form.
Date: October 1, 1968
Creator: DesChamps, N.H.
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Partner: UNT Libraries Government Documents Department