Quarterly progress report for Q2 FY06 for Complex Transient Events in Materials Studied Using Ultrafast Electron Probes and Terascale Simulation (FWP SCW0289)
Description: In this quarter (Q2 FY06), the DTEM underwent a substantial reconfiguration of its laser systems. The cathode laser system was changed to provide greater numbers of electrons per pulse by lengthening the time duration of the pulse to 30 ns. The greater number of electrons per pulse has allowed us to acquire high quality pulsed images and diffraction patterns. The spatial resolution in the single pulsed image has been measured at better than 20 nm. The diffraction patterns are now more comparable to conventional electron microscope operation. Examples are found in the body of the report. We summarize important achievements in the following list: (1) Instrument performance and design improvements--(A) The laser system was changed for the cathode photoemission system (75 ns at 1053 nm wavelength converted to 30ns at 211 nm wavelength) to give longer electron pulses at the same current to yield more electrons per pulse. (B) New specimen drive laser constructed. (C) New computer monitored and controlled alignment systems installed for both laser systems to facilitate laser alignment through a user friendly computer interface. (2) Experimental Progress--(A) The spatial resolution of pulsed images was tested by imaging a cross-section of multilayer thin foils with 30 nm and 20 nm periods. Single pulse images were observed to have spatial resolution better than 20 nm. This combination of 20 nm spatial and 30 ns temporal resolution is thought to be highest combined spatial and temporal measurement ever made. (B) The quality of single pulse electron diffraction patterns have been improved to the point where differentiating the HCP from BCC patterns in Ti is substantially easier. The spatial coherence of the electron illumination on the specimen was improved to give much smaller diffraction spots in the pattern.
Date: March 29, 2006
Creator: Campbell, G. H.
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