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Lithographic measurement of EUV flare in the 0.3-NA Micro ExposureTool optic at the Advanced Light Source

Description: The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Lawrence Berkeley National Laboratory is measured using a lithographic method. Photoresist behavior at high exposure doses makes analysis difficult. Flare measurement analysis under scanning electron microscopy (SEM) and optical microscopy is compared, and optical microscopy is found to be a more reliable technique. In addition, the measured results are compared with predictions based on surface roughness measurement of the MET optical elements. When the fields in the exposure matrix are spaced far enough apart to avoid influence from surrounding fields and the data is corrected for imperfect mask contrast and aerial image proximity effects, the results match predicted values quite well. The amount of flare present in this optic ranges from 4.7% for 2 {micro}m features to 6.8% for 500 nm features.
Date: January 1, 2005
Creator: Cain, Jason P.; Naulleau, Patrick & Spanos, Costas J.
Partner: UNT Libraries Government Documents Department

Resist-based measurement of contrast transfer function in a 0.3-NAmicrofield optic

Description: Although extreme ultraviolet (EUV) lithography offers the possibility of very high-resolution patterning, the projection optics must be of extremely high quality in order to meet this potential. One key metric of the projection optic quality is the contrast transfer function (CTF), which is a measure of the aerial image contrast as a function of pitch. A static microfield exposure tool based on the 0.3-NA MET optic and operating at a wavelength of 13.5 nm has been installed at the Advanced Light Source, a synchrotron facility at the Lawrence Berkeley National Laboratory. This tool provides a platform for a wide variety of research into EUV lithography. In this work we present resist-based measurements of the contrast transfer function for the MET optic. These measurements are based upon line/space patterns printed in several different EUV photoresists. The experimental results are compared with the CTF in aerial-image simulations using the aberrations measured in the projection optic using interferometry. In addition, the CTF measurements are conducted for both bright-field and dark-field mask patterns. Finally, the orientation dependence of the CTF is measured in order to evaluate the effect of non-rotationally symmetric lens aberrations. These measurements provide valuable information in interpreting the results of other experiments performed using the MET and similar systems.
Date: January 11, 2005
Creator: Cain, Jason P.; Naulleau, Patrick & Spanos, Costas J.
Partner: UNT Libraries Government Documents Department

Critical dimension sensitivity to post-exposure bake temperaturevariation in EUV photoresists

Description: Chemically amplified resists depend upon the post-exposure bake (PEB) process to drive the deprotection reactions (in positive resists) that lead to proper resist development. For this reason they often exhibit critical dimension (CD) sensitivity to PEB temperature variation. In this work the effects of variation in different aspects of the PEB step on post-develop CD are studied for two extreme ultraviolet (EUV) photoresists. The spatial and temporal temperature uniformity of the PEB plate is measured using a wireless sensor wafer. Programmed variations in the bake plate temperature set point are then used to measure the CD sensitivity to steady state temperature variation. In addition, the initial temperature ramp time is modified using a thin sheet of polyimide film between the wafer and the bake plate. This allows for measurement of the CD sensitivity to transient temperature variation. Finally, the bake time is adjusted to measure the CD sensitivity to this parameter.
Date: January 11, 2005
Creator: Cain, Jason P.; Naulleau, Patrick & Spanos, Costas J.
Partner: UNT Libraries Government Documents Department

Modeling of EUV photoresists with a resist point spreadfunction

Description: Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm technology node. One active area of research in this field is the development of photoresists that can meet the stringent requirements (high resolution, high sensitivity, low LER, etc.) of lithography in this regime. In order to facilitate research in this and other areas related to EUV lithography, a printing station based upon the 0.3-NA Micro Exposure Tool (MET) optic was established at the Advanced Light Source, a synchrotron facility at Lawrence Berkeley National Laboratory. A resist modeling technique using a resist point spread function has been shown to have good agreement with experiments for certain EUV resists such as Shipley EUV-2D [2]. The resist point spread function is a two-dimensional function that, when convolved with the simulated aerial image for a given mask pattern and applied to a threshold function, gives a representation of the photoresist pattern remaining after development. The simplicity of this modeling approach makes it attractive for rapid modeling of photoresists for process development applications. In this work, the resist point spread functions for three current high-resolution EUV photoresists [Rohm and Haas EUV-2D, Rohm and Haas MET-1K (XP 3454C), and KRS] are extracted experimentally. This model is then used in combination with aerial image simulations (including effects of projection optic aberrations) to predict the resist pattern for a variety of test patterns. A comparison is made between these predictions and experimental results to evaluate the effectiveness of this modeling technique for newer high-resolution EUV resists.
Date: January 1, 2005
Creator: Cain, Jason P.; Naulleau, Patrick & Spanos, Costas J.
Partner: UNT Libraries Government Documents Department