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Thermal Expansion of AuIn2

Description: The thermal expansion of AuIn{sub 2} gold is of great interest in soldering technology. Indium containing solders have been used to make gold wire interconnects at low soldering temperature and over time, AuIn{sub 2} is formed between the gold wire and the solder due to the high heat of formation and the high inter-metallic diffusion of indium. Hence, the thermal expansion of AuIn{sub 2} alloy in comparison with that of the gold wire and the indium-containing solder is critical in determining t… more
Date: July 12, 2004
Creator: Saw, C K & Siekhaus, W J
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Innovative Seals for Solid Oxide Fuel Cells (SOFC)

Description: A functioning SOFC requires different type of seals such as metal-metal, metal-ceramic, and ceramic-ceramic. These seals must function at high temperatures between 600--900{sup o}C and in oxidizing and reducing environments of the fuels and air. Among the different type of seals, the metal-metal seals can be readily fabricated using metal joining, soldering, and brazing techniques. However, the metal-ceramic and ceramic-ceramic seals require significant research and development because the brit… more
Date: June 30, 2008
Creator: Singh, Raj
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
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Cathodic ARC surface cleaning prior to brazing

Description: Surface cleanliness is one the critical process variables in vacuum furnace brazing operations. For a large number of metallic components, cleaning is usually accomplished either by water-based alkali cleaning, but may also involve acid etching or solvent cleaning / rinsing. Nickel plating may also be necessary to ensure proper wetting. All of these cleaning or plating technologies have associated waste disposal issues, and this article explores an alternative cleaning process that generates mi… more
Date: January 1, 2002
Creator: Dave, Vivek R.; Hollis, Kendall J.; Castro, Richard G.; Smith, Frank M. & Javernick, Daniel A.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

Description: Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would … more
Date: April 22, 2009
Creator: Wolfe, Larry
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
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Evaluation of Heat Checking and Washout of Heat Resistant Superalloys and Coatings for Die inserts

Description: This project had two main objectives: (1) To design, fabricate and run a full size test for evaluating soldering and washout in die insert materials. This test utilizes the unique capabilities of the 350 Ton Squeeze Casting machine available in the Case Meal Casting Laboratory. Apply the test to evaluate resistance of die materials and coating, including heat resistant alloys to soldering and washout damage. (2) To evaluate materials and coatings, including heat resistant superalloys, for use a… more
Date: January 30, 2005
Creator: Schwam, David; Wallace, John F.; Zhu, Yulong; Courtright, Edward & Adkins, Harold
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Spreading of Sn-Ag solders on FeNi alloys

Description: The spreading of Sn-3Ag-xBi solders on Fe-42Ni has been studied using a drop transfer setup. Initial spreading velocities as fast as {approx}0.5 m/s have been recorded. The results are consistent with a liquid front moving on a metastable, flat, unreacted substrate and can be described by using a modified molecular-kinetic model for which the rate controlling step is the movement of one atom from the liquid to the surface of the solid substrate. Although the phase diagram predicts the formation… more
Date: February 28, 2003
Creator: Saiz, Eduardo; Hwang, C-W.; Suganuma, Katsuaki & Tomsia, Antoni P.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Die Materials for Critical Applications and Increased Production Rates

Description: Die materials for aluminum die-casting need to be resistant to heat checking, and have good resistance to washout and to soldering in a fast flow of molten aluminum. To resist heat checking, die materials should have a low coefficient of thermal expansion, high thermal conductivity, high hot yield strength, good temper softening resistance, high creep strength, and adequate ductility. To resist the washout and soldering, die materials should have high hot hardness, good temper resistance, low s… more
Date: November 30, 2002
Creator: Schwam, David; Wallace, John & Birceanu, Sebastian
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Solidification Diagnostics for Joining and Microstructural Simulations

Description: Solidification is an important aspect of welding, brazing, soldering, LENS fabrication, and casting. The current trend toward utilizing large-scale process simulations and materials response models for simulation-based engineering is driving the development of new modeling techniques. However, the effective utilization of these models is, in many cases, limited by a lack of fundamental understanding of the physical processes and interactions involved. In addition, experimental validation of mod… more
Date: January 1, 2003
Creator: ROBINO, CHARLES V.; HALL, AARON C.; BROOKS, JOHN ALBERT; HEADLEY, THOMAS J. & ROACH, R. ALLEN
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Printed wiring board fabrication and lead elimination via single-bath electrodeposition

Description: Printed wiring board (PWB) fabrication, an operation performed both at LLNL and throughout the electronics industry, generates considerable quantities of hazardous waste, notably lead-bearing materials used for soldering, tinning, and finish coating the circuits of the board. Hot-air solder leveling (HASL), the most common method of finishing is one of the main sources of hazardous lead-bearing wastes in traditional PWB manufacturing. The development of a safer finishing method will lead to emp… more
Date: February 21, 2001
Creator: Meltzer, M P & Steffani, C P
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

Description: The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter … more
Date: August 1, 2006
Creator: Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank & Zender, Gary L.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80).

Description: A study was performed that examined the microstructure and mechanical properties of 63Sn-37Pb (wt.%, Sn-Pb) solder joints made to thick film layers on low-temperature co-fired (LTCC) substrates. The thick film layers were combinations of the Dupont{trademark} 4596 (Au-Pt-Pd) conductor and Dupont{trademark} 5742 (Au) conductor, the latter having been deposited between the 4596 layer and LTCC substrate. Single (1x) and triple (3x) thicknesses of the 4596 layer were evaluated. Three footprint size… more
Date: June 1, 2006
Creator: Uribe, Fernando; Vianco, Paul Thomas & Zender, Gary L.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Casting Characteristics of Aluminum Die Casting Alloys

Description: The research program investigates the casting characteristics of selected aluminum die casting alloys. Specifically, the alloys' tendencies towards die soldering and sludge formation, and the alloys' fluidity and machinability are evaluated. It was found that: When the Fe and Mn contents of the alloy are low; caution has to be taken against possible die soldering. When the alloy has a high sludge factor, particularly a high level of Fe, measures must be taken to prevent the formation of large h… more
Date: February 5, 2002
Creator: Makhlouf, Makhlouf M. & Apelian, Diran
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

The impact of process parameters on gold elimination from soldered connector assemblies

Description: Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A long… more
Date: February 2, 2000
Creator: VIANCO,PAUL T. & KILGO,ALICE C.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Die Soldering in Aluminium Die Casting

Description: Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum… more
Date: March 15, 2000
Creator: Han, Q.; Kenik, E.A. & Viswanathan, S.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

A new active solder for joining electronic components

Description: Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstruct… more
Date: May 11, 2000
Creator: Smith, Ronald W.; Vianco, Paul T.; Hernandez, Cynthia L.; Lugscheider, E.; Rass, I. & Hillen, F.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Lead (Pb)-Free Solder Applications

Description: Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range … more
Date: August 15, 2000
Creator: VIANCO,PAUL T.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
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Continuous, Automated Manufacturing of String Ribbon Si PV Modules: Final Report, 21 May 1998 - 20 May 2001

Description: This report summarizes the work done under a three-year PVMaT Phase 5A2 program. The overall goal was to attain a continuous, highly automated, fully integrated PV production line. In crystal growth, advances were made that resulted in lower substrate costs, higher yields, and lower capital and labor costs. A new string material was developed and implemented. Following this development, better control of the edge meniscus was achieved. A completely new furnace design was accomplished, and this … more
Date: August 1, 2001
Creator: Hanoka, J. I.
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
open access

Hybrid microcircuit board assembly with lead-free solders

Description: An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminate… more
Date: January 11, 2000
Creator: Vianco, P. T.; Hernandez, C. L. & Rejent, J. A.
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Constitutive modeling of viscoplastic damage in solder material

Description: This paper presents a constitutive modeling of viscoplastic damage in 63Sn-37Pb solder material taking into account the effects of microstructural change in grain coarsening. Based on the theory of damage mechanics, a two-scalar damage model is developed by introducing the damage variables and the free energy equivalence principle. An inelastic potential function based on the concept of inelastic damage energy release rate is proposed and used to derive an inelastic damage evolution equation. T… more
Date: April 17, 2000
Creator: WEI,YONG; CHOW,C.L.; NEILSEN,MICHAEL K. & FANG,HUEI ELIOT
Item Type: Refine your search to only Article
Partner: UNT Libraries Government Documents Department
open access

Science & Technology Review October 2005

Description: This month's issue has the following articles: (1) Important Missions, Great Science, and Innovative Technology--Commentary by Cherry A. Murray; (2) NanoFoil{reg_sign} Solders with Less Heat--Soldering and brazing to join an array of materials are now Soldering and brazing to join an array of materials are now possible without furnaces, torches, or lead; (3) Detecting Radiation on the Move--An award-winning technology can detect even small amounts An award-winning technology can detect even sma… more
Date: August 22, 2005
Creator: Aufderheide, M. B., III
Item Type: Refine your search to only Report
Partner: UNT Libraries Government Documents Department
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