An aluminum resist substrate for microfabrication by LIGA.
Description:
Resist substrates used in the LIGA process must provide high initial bond strength between the substrate and resist, little degradation of the bond strength during x-ray exposure, acceptable undercut rates during development, and a surface enabling good electrodeposition of metals. Additionally, they should produce little fluorescence radiation and give small secondary doses in bright regions of the resist at the substrate interface. To develop a new substrate satisfying all these requirements,…
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Date:
April 1, 2005
Creator:
Kelly, James J.; Boehme, Dale R.; Hauck, Cheryl A. (Lawrence Berkeley National Laboratory, Berkeley, CA); Yang, Chu-Yeu Peter; Hunter, Luke L.; Griffiths, Stewart K. et al.
Item Type:
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Partner:
UNT Libraries Government Documents Department